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    Design for thermo-mechanical reliability of a 3D microelectronic component using 3D FEM 

    Type: Conference Paper
    Author : Belhenini, S. , Tougui, A. , Dosseul, F.
    Publisher: IEEE
    Year: 2014

    Implementing context aware scenarios to enable smart health in complex urban environments 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Modeling of a tubular permanent magnet linear generator for wave energy conversion using finite element method 

    Type: Conference Paper
    Author : Hamim, M.A.F.M. , Ibrahim, T. , Nor, N.M.
    Publisher: IEEE
    Year: 2014

    A fine-grain partial MAC virtualization to support cross layer design in wireless ad hoc networks 

    Type: Conference Paper
    Author : Seon Yeong Han; Byoungheon Shin; Dongman Lee
    Publisher: IEEE
    Year: 2014

    Applications of saturable-core reactors (SCR) in power systems 

    Type: Conference Paper
    Author : Dimitrovski, A. , Li, Z. , Ozpineci, B.
    Publisher: IEEE
    Year: 2014

    Visual analytics for neuroscience-inspired dynamic architectures 

    Type: Conference Paper
    Author : Drouhard, Margaret; Schuman, Catherine D.; Birdwell, J.Douglas; Dean, Mark E.
    Publisher: IEEE
    Year: 2014

    Hierarchical multi-tenant pattern 

    Type: Conference Paper
    Author : Ngo Huy Bien , Tran Dan Thu
    Publisher: IEEE
    Year: 2014

    Study on particle swarm optimization (PSO) for aircraft parameter identification based on BeiDou satellite system and strapdown AHRS integrated navigation 

    Type: Conference Paper
    Author : Liyong, Zhang; Jian, Xu; Yidong, Zheng; Zhinan, Huang; Jianglong, Yu
    Publisher: IEEE
    Year: 2014

    Coherent Multimode OAM Superpositions for Multidimensional Modulation 

    Type: Journal Paper
    Author : Anguita, Jaime /A/.; Herreros, Joaquin; Djordjevic, Ivan B.
    Publisher: IEEE
    Year: 2014

    Light Trapping in Finite Arrays of Metallic U-Shaped Cavities for Sensing With High Figures of Merit 

    Type: Journal Paper
    Author : Ya-Lun Ho; Yaerim Lee; Delaunay, Jean-Jacques
    Publisher: IEEE
    Year: 2014
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