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High power SiC inverter module packaging solutions for junction temperature over 220°C

Type: Conference Paper

Author : Woo, Daniel Rhee Min; Yuan, Hwang How; Li, Jerry Aw Jie; Ling, Ho Siow; Bum, Lee Jong; Songbai, Zhang

Publisher: IEEE

Year: 2014

Reducing the standard compliance uncertainty by using ferrite type CMADs during radiated disturbance measurements acc. to CISPR 16-2-3

Type: Conference Paper

Author : Medler, Jens

Publisher: IEEE

Year: 2014

Amazing use of ISG for implementing information systems

Type: Conference Paper

Author : Ling-Hua Chang; Behl, S.; Tung-Ho Shieh

Publisher: IEEE

Year: 2014

33% Capacity improvement of a direct-modulation direct-detection OFDM link using adaptive Volterra equalization

Type: Conference Paper

Author : Andre, Nuno Sequeira; Louchet, Hadrien; Habel, Kai; Richter, Andre

Publisher: IEEE

Year: 2014

Multistage SFM: Revisiting Incremental Structure from Motion

Type: Conference Paper

Author : Shah, Rajvi; Deshpande, Aditya; Narayanan, P.J.

Publisher: IEEE

Year: 2014

Ellipses from triangles

Type: Conference Paper

Author : Cicconet, M.; Gunsalus, K.; Geiger, D.; Werman, M.

Publisher: IEEE

Year: 2014

An efficient scan algorithm for block-based connected component labeling

Type: Conference Paper

Author : Wan-Yu Chang; Chung-Cheng Chiu

Publisher: IEEE

Year: 2014

Nonlinear impact of diverse optical routing in uncompensated 120 Gb/s PM-QPSK links

Type: Conference Paper

Author : Searcy, Steven; Tibuleac, Sorin

Publisher: IEEE

Year: 2014

Digital and analog signal transmission technologies based on multi-level modulation and precise lightwave control

Type: Conference Paper

Author : Kawanishi, Tetsuya; Kanno, Atsushi

Publisher: IEEE

Year: 2014

Study Quality Evaluation in Educational System

Type: Conference Paper

Author : Lizhen Liu; Wenbin Xu; Wei Song; Hanshi Wang; Hao Liu; Haining Xu; Tao Chi

Publisher: IEEE

Year: 2014

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High power SiC inverter module packaging solutions for junction temperature over 220°C

Reducing the standard compliance uncertainty by using ferrite type CMADs during radiated disturbance measurements acc. to CISPR 16-2-3

Amazing use of ISG for implementing information systems

33% Capacity improvement of a direct-modulation direct-detection OFDM link using adaptive Volterra equalization

Multistage SFM: Revisiting Incremental Structure from Motion

Ellipses from triangles

An efficient scan algorithm for block-based connected component labeling

Nonlinear impact of diverse optical routing in uncompensated 120 Gb/s PM-QPSK links

Digital and analog signal transmission technologies based on multi-level modulation and precise lightwave control

Study Quality Evaluation in Educational System

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High power SiC inverter module packaging solutions for junction temperature over 220&#x00B0;C

Reducing the standard compliance uncertainty by using ferrite type CMADs during radiated disturbance measurements acc. to CISPR 16-2-3

Amazing use of ISG for implementing information systems

33% Capacity improvement of a direct-modulation direct-detection OFDM link using adaptive Volterra equalization

Multistage SFM: Revisiting Incremental Structure from Motion

Ellipses from triangles

An efficient scan algorithm for block-based connected component labeling

Nonlinear impact of diverse optical routing in uncompensated 120 Gb/s PM-QPSK links

Digital and analog signal transmission technologies based on multi-level modulation and precise lightwave control

Study Quality Evaluation in Educational System

High power SiC inverter module packaging solutions for junction temperature over 220°C