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Optimization of the wafer level molding process for high power device module
Publisher: IEEE
Year: 2014
Selection of the best shape for a micro painless needle
Publisher: IEEE
Year: 2014
Steganography on thermal images using generation technique
Publisher: IEEE
Year: 2014
First principles study of half Heusler alloys PdFeBi and PdCoBi
Publisher: IEEE
Year: 2014



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