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نمایش تعداد 1-4 از 4
Optimization of the wafer level molding process for high power device module
ناشر: IEEE
سال: 2014
Selection of the best shape for a micro painless needle
ناشر: IEEE
سال: 2014
Steganography on thermal images using generation technique
ناشر: IEEE
سال: 2014
First principles study of half Heusler alloys PdFeBi and PdCoBi
ناشر: IEEE
سال: 2014



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