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Displacement modeling of a digital actuators array for 2D conveyance application
Publisher: IEEE
Year: 2014
Seam Carving for Color-Plus-Depth 3D Image
Publisher: IEEE
Year: 2014
Investigation of near-field wireless power transfer between two efficient electrically small planar antennas
Publisher: IEEE
Year: 2014
Application of information index model in landslide susceptibility mapping on Tonggu Jiangxi PROVINCE, China
Publisher: IEEE
Year: 2014
Minimizing big data problems using cloud computing based on Hadoop architecture
Publisher: IEEE
Year: 2014
Effectiveness of dual-rail CSSAL against power analysis attack under CMOS process variation
Publisher: IEEE
Year: 2014