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    Understanding temporal and spatial travel patterns of individual passengers by mining smart card data 

    Type: Conference Paper
    Author : Juanjuan Zhao; Chen Tian; Fan Zhang; Chengzhong Xu; Shengzhong Feng
    Publisher: IEEE
    Year: 2014

    A folded compact antenna for broadband RFID UHF application 

    Type: Conference Paper
    Author : Guerchouche, Kamel; Rolland, Nathalie; Loyez, Christophe
    Publisher: IEEE
    Year: 2014

    Frame Theory and Optimal Anchor Geometries in Wireless Localization 

    Type: Conference Paper
    Author : Van de Velde, Samuel; Abreu, Giuseppe; Steendam, Heidi
    Publisher: IEEE
    Year: 2014

    Empirical Study on the Effect of a Software Architecture Representation's Abstraction Level on the Architecture-Level Software Understanding 

    Type: Conference Paper
    Author : Stevanetic, Srdjan; Zdun, Uwe
    Publisher: IEEE
    Year: 2014

    Fire detection using stereoscopic imaging and image processing techniques 

    Type: Conference Paper
    Author : Li, Guodong; Lu, Gang; Yan, Yong
    Publisher: IEEE
    Year: 2014

    Empirical capacity modeling and evaluation of delay tolerant network routing protocols 

    Type: Conference Paper
    Author : Deng, J.D.
    Publisher: IEEE
    Year: 2014

    S2-T4: Low-temperature substrate bonding technology for high power GaN-on-diamond HEMTs 

    Type: Conference Paper
    Author : Chu, Kenneth K.; Chao, Pane C.; Diaz, Jose A.; Yurovchak, Thomas; Creamer, Carlton T.; Sweetland, Scott; Kallaher, Raymond L.; McGray, Craig
    Publisher: IEEE
    Year: 2014

    Understanding and Classifying the Quality of Technical Forum Questions 

    Type: Conference Paper
    Author : Ponzanelli, Luca; Mocci, Andrea; Bacchelli, Alberto; Lanza, Michele
    Publisher: IEEE
    Year: 2014

    Elimination of inrush current using a new prefluxing method. Application to a single-phase transformer 

    Type: Conference Paper
    Author : de Castro Cezar, V.Oiring; Rouve, L-L.; Coulomb, J-L.; Zgainski, F-X.; Chadebec, O.; Caillault, B.
    Publisher: IEEE
    Year: 2014

    A solder joint structure with vertically aligned carbon nanofibres as reinforcements 

    Type: Conference Paper
    Author : Chen, Si; Jiang, Di; Ye, Lilei; Liu, Johan
    Publisher: IEEE
    Year: 2014
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