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    Issues of thermal transient testing on photovoltaic modules 

    Type: Conference Paper
    Author : Plesz, B.; Ress, S.; Szabo, P.G.; Hantos, G.; Dudola, D.
    Publisher: IEEE
    Year: 2014

    Privacy-Preserving Queries over Outsourced Data with Access Pattern Protection 

    Type: Conference Paper
    Author : Li, Shun-Pun; Wong, Man-Hon
    Publisher: IEEE
    Year: 2014

    Study on key technologies of permanent magnet synchronous motor design for electric vehicles 

    Type: Conference Paper
    Author : Ying Xie; Hongyan Ge; Zhongxue Yang; Sen Lv
    Publisher: IEEE
    Year: 2014

    Techniques for dynamic range enhancement in a frequency-folded broadband channelizer 

    Type: Conference Paper
    Author : Wei-Gi Ho; Singh, V.; Forbes, T.; Gharpurey, R.
    Publisher: IEEE
    Year: 2014

    Similitude: Interfacing a Traffic Simulator and Network Simulator with Emulated Android Clients 

    Type: Conference Paper
    Author : Hetu, Seth N.; Hamishagi, Vahid Saber; Peh, Li-Shiuan
    Publisher: IEEE
    Year: 2014

    A comparative study on the performances of the DF techniques using a single acoustic vector sensor 

    Type: Conference Paper
    Author : Gunes, Ahmet; Guldogan, Mehmet B.; Bereketli, Alper
    Publisher: IEEE
    Year: 2014

    Separation of failure modes in short cycle time power cycling experiments 

    Type: Conference Paper
    Author : Sarkany, Zoltan; Vass-Varnai, Andras; Rencz, Marta
    Publisher: IEEE
    Year: 2014

    Green's function solution of hyperbolic heat equation suitable for thermal analysis of electronic nanostructures 

    Type: Conference Paper
    Author : Janicki, Marcin; Zubert, Mariusz; Napieralski, Andrzej
    Publisher: IEEE
    Year: 2014

    Thermal properties of interconnects in power MOSFETs 

    Type: Conference Paper
    Author : Burenkov, Alex; Baer, Eberhard; Boianceanu, Cristian
    Publisher: IEEE
    Year: 2014

    Active dipole coupling in an array environment 

    Type: Conference Paper
    Author : Visser, Hubregt J.; Lulu Chan
    Publisher: IEEE
    Year: 2014
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