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Now showing items 1-10 of 14
Innovative wafer level package manufacturing with FlexLine<sup>TM</sup>
Publisher: IEEE
Year: 2014
Wave-packet image fusion technique based on genetic algorithm
Publisher: IEEE
Year: 2014
A three stage hybrid model to perform feature level speech signal recognition
Publisher: IEEE
Year: 2014
Banquet speaker
Publisher: IEEE
Year: 2014
3D non-rigid pattern recognition based on structural analysis
Publisher: IEEE
Year: 2014
Conference committees
Publisher: IEEE
Year: 2014
Numerical conformal transformations for modeling of coupled round conductors with an eccentric shielded pair
Publisher: IEEE
Year: 2014
Output synchronization of uncertain nonlinear multi-agent systems with relative degree one
Publisher: IEEE
Year: 2014
High-resolution SAR signal simulation using parallel FDTD method
Publisher: IEEE
Year: 2014