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    Capping technologies for wafer level MEMS packaging based on permanent and temporary wafer bonding 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Dual-field-of-view star sensors utilizing optical tagging approach by grating 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Study on dynamic wavelength allocation between Uplink and downlink in mobile fronthaul 

    Type: Conference Paper
    Author : Kubo, T. , Asai, T. , Okumura, Y.
    Publisher: IEEE
    Year: 2014

    Information extraction based on probing algorithm with Bayesian approach 

    Type: Conference Paper
    Author : Danie Davidson, J.; Jacob, I.Jeena; Srinivasagam, K.G.
    Publisher: IEEE
    Year: 2014

    Design of a wireless power transmission system for portable electronic equipment 

    Type: Conference Paper
    Author : Guoen Cao; Hee-Jun Kim; Donchul Choi; Jaewoo Lim; Puyang Cheng; Seok Bae
    Publisher: IEEE
    Year: 2014

    A Digital Hygrometer for Trace Moisture Measurement 

    Type: Journal Paper
    Author : Islam, Tarikul; Khan, Anwar Ulla; Akhtar, Jamil; Rahman, Mohammad Zia Ur
    Publisher: IEEE
    Year: 2014

    Assessing Energy Efficiency in ISP and Web Search Engine Collaboration 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Recursive input reconstruction with a delay 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Multicast-aware caching for small cell networks 

    Type: Conference Paper
    Author : Poularakis, Konstantinos; Iosifidis, George; Sourlas, Vasilis; Tassiulas, Leandros
    Publisher: IEEE
    Year: 2014

    A comparison of the formation of bubbles and water droplets in vegetable and mineral oil impregnated transformer paper 

    Type: Journal Paper
    Author : Perkasa, Caesar Y.; Lelekakis, Nick; Czaszejko, Tadeusz; Wijaya, Jaury; Martin, Daniel
    Publisher: IEEE
    Year: 2014
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