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نمایش تعداد 1-6 از 6

Robustness guaranteed cost control for discrete-time systems with dynamic quantization

نوع: Conference Paper

نویسنده : Wei-Wei Che , Zhi-Yong Mei

ناشر: IEEE

سال: 2014

Investigation of energy storage and open cycle gas turbine for load frequency regulation

نوع: Conference Paper

نویسنده : Bo Lian; Dongmin Yu; Cheng Wang; Le Blond, S.; Dunn, R.W.

ناشر: IEEE

سال: 2014

CREMA-D: Crowd-Sourced Emotional Multimodal Actors Dataset

نوع: Journal Paper

نویسنده : Houwei Cao; Cooper, David G.; Keutmann, Michael K.; Gur, Ruben C.; Nenkova, Ani; Verma, Rajesh

ناشر: IEEE

سال: 2014

Message from Program Chairs

نوع: Conference Paper

ناشر: IEEE

سال: 2014

Impact of RDL polymer on reliability of flip chip interconnects in thermal cycling — Correlation of experiments with finite element simulations

نوع: Conference Paper

نویسنده : Muller, Matthias; Wohrmann, Markus; Wittler, Olaf; Bader, Volker; Topper, Michael; Lang, Klaus-Dieter

ناشر: IEEE

سال: 2014

Computer aided analysis of projective tests

نوع: Conference Paper

نویسنده : Lacrama, D.L.; Pintea, F.A.; Karnyanszky, T.M.; Codat, D.S.

ناشر: IEEE

سال: 2014

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Robustness guaranteed cost control for discrete-time systems with dynamic quantization

Investigation of energy storage and open cycle gas turbine for load frequency regulation

CREMA-D: Crowd-Sourced Emotional Multimodal Actors Dataset

Message from Program Chairs

Impact of RDL polymer on reliability of flip chip interconnects in thermal cycling — Correlation of experiments with finite element simulations

Computer aided analysis of projective tests

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Robustness guaranteed cost control for discrete-time systems with dynamic quantization

Investigation of energy storage and open cycle gas turbine for load frequency regulation

CREMA-D: Crowd-Sourced Emotional Multimodal Actors Dataset

Message from Program Chairs

Impact of RDL polymer on reliability of flip chip interconnects in thermal cycling &#x2014; Correlation of experiments with finite element simulations

Computer aided analysis of projective tests

Impact of RDL polymer on reliability of flip chip interconnects in thermal cycling — Correlation of experiments with finite element simulations