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    Numerical 3-D FEM and Experimental Analysis of the Open-Ended Coaxial Line Technique for Microwave Dielectric Spectroscopy on Soil 

    Type: Journal Paper
    Author : Wagner, N.; Schwing, M.; Scheuermann, A.
    Publisher: IEEE
    Year: 2014

    Improved measurement of acoustic output using complex deconvolution of hydrophone sensitivity 

    Type: Journal Paper
    Author : Wear, Keith; Gammell, Paul; Maruvada, Subha; Liu, Yanbing; Harris, Gerald
    Publisher: IEEE
    Year: 2014

    High-Power CMOS Current Driver With Accurate Transconductance for Electrical Impedance Tomography 

    Type: Journal Paper
    Author : Constantinou, Loucas; Triantis, Iasonas F.; Bayford, Richard; Demosthenous, Andreas
    Publisher: IEEE
    Year: 2014

    LLC Resonant Converter With Matrix Transformer 

    Type: Journal Paper
    Author : Daocheng Huang; Shu Ji; Lee, Fred C.
    Publisher: IEEE
    Year: 2014

    Channel Multiplexing Technique Utilizing Electric and Magnetic Components of a Radio Wave 

    Type: Journal Paper
    Author : Nikravan, M.A.; Schantz, Hans G.; Unden, Alfred H.; Do-Hoon Kwon
    Publisher: IEEE
    Year: 2014

    Lorentz-force hydrophone characterization 

    Type: Journal Paper
    Author : Grasland-Mongrain, Pol; Mari, Jean-Martial; Gilles, Benjamin; Poizat, Adrien; Chapelon, Jean-Yves; Lafon, Cyril
    Publisher: IEEE
    Year: 2014

    Histotripsy-induced cavitation cloud initiation thresholds in tissues of different mechanical properties 

    Type: Journal Paper
    Author : Vlaisavljevich, Eli; Maxwell, A.; Warnez, Matthew; Johnsen, Eric; Cain, Charles; Zhen Xu
    Publisher: IEEE
    Year: 2014

    Proactive Model-Based Performance Analysis and Security Tradeoffs in a Complex System 

    Type: Conference Paper
    Author : Musgrove, J. , Cukic, B. , Cortellessa, V.
    Publisher: IEEE
    Year: 2014

    [D74] Haptic turk: A motion platform based on people 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Reliability Prediction Approach of DC-DC Converter with Electrical Stress Analysis 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014
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