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Now showing items 1-10 of 62

Packaging a <formula formulatype="inline"> <img src="/images/tex/473.gif" alt="W"> </formula>-Band Integrated Module With an Optimized Flip-Chip Interconnect on an Organic Substrate

Type: Journal Paper

Author : Khan, Wasif T.; Lopez, Aida L. Vera; Ulusoy, /A/. Cagri; Papapolymerou, John

Publisher: IEEE

Year: 2014

A Concurrent <formula formulatype="inline"> <img src="/images/tex/21276.gif" alt="Ku/K/Ka"> </formula> Tri-Band Distributed Power Amplifier With Negative-Resistance Active Notch Using SiGe BiCMOS Process

Type: Journal Paper

Author : Kyoungwoon Kim; Nguyen, Cam

Publisher: IEEE

Year: 2014

Sub-THz Sensor Array With Embedded Signal Processing in 90 nm CMOS Technology

Type: Journal Paper

Author : Karolyi, Gergely; Gergelyi, Domonkos; Foldesy, Peter

Publisher: IEEE

Year: 2014

GASPAD: A General and Efficient mm-Wave Integrated Circuit Synthesis Method Based on Surrogate Model Assisted Evolutionary Algorithm

Type: Journal Paper

Author : Bo Liu; Dixian Zhao; Reynaert, Patrick; Gielen, Georges G. E.

Publisher: IEEE

Year: 2014

50 GHz mm-Wave CMOS Active Inductor

Type: Journal Paper

Author : Pepe, Domenico; Zito, Domenico

Publisher: IEEE

Year: 2014

Classifying text documents using unconventional representation

Type: Conference Paper

Author : Harish, B.S. , Aruna Kumar, S.V. , Manjunath, S.

Publisher: IEEE

Year: 2014

A comparison of CUDA and OpenACC: Accelerating the Tsunami Simulation EasyWave

Type: Conference Paper

Publisher: IEEE

Year: 2014

Modeling steep slope devices: From circuits to architectures

Type: Conference Paper

Publisher: IEEE

Year: 2014

Nonlinear Stress Analysis of Cable-Pylon Anchorage Zones RC of Extra-Dosed Cable-Stayed Bridge in Railway

Type: Conference Paper

Author : Chen Xingchong , Liu Zunwen , Wang Changfeng

Publisher: IEEE

Year: 2014

Fast and fine-grained counting and identification via constructive interference in WSNs

Type: Conference Paper

Publisher: IEEE

Year: 2014

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Packaging a <formula formulatype="inline"> <img src="/images/tex/473.gif" alt="W"> </formula>-Band Integrated Module With an Optimized Flip-Chip Interconnect on an Organic Substrate

A Concurrent <formula formulatype="inline"> <img src="/images/tex/21276.gif" alt="Ku/K/Ka"> </formula> Tri-Band Distributed Power Amplifier With Negative-Resistance Active Notch Using SiGe BiCMOS Process

Sub-THz Sensor Array With Embedded Signal Processing in 90 nm CMOS Technology

GASPAD: A General and Efficient mm-Wave Integrated Circuit Synthesis Method Based on Surrogate Model Assisted Evolutionary Algorithm

50 GHz mm-Wave CMOS Active Inductor

Classifying text documents using unconventional representation

A comparison of CUDA and OpenACC: Accelerating the Tsunami Simulation EasyWave

Modeling steep slope devices: From circuits to architectures

Nonlinear Stress Analysis of Cable-Pylon Anchorage Zones RC of Extra-Dosed Cable-Stayed Bridge in Railway

Fast and fine-grained counting and identification via constructive interference in WSNs

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Packaging a <formula formulatype="inline"> <img src="/images/tex/473.gif" alt="W"> </formula>-Band Integrated Module With an Optimized Flip-Chip Interconnect on an Organic Substrate

A Concurrent <formula formulatype="inline"> <img src="/images/tex/21276.gif" alt="Ku/K/Ka"> </formula> Tri-Band Distributed Power Amplifier With Negative-Resistance Active Notch Using SiGe BiCMOS Process

Sub-THz Sensor Array With Embedded Signal Processing in 90 nm CMOS Technology

GASPAD: A General and Efficient mm-Wave Integrated Circuit Synthesis Method Based on Surrogate Model Assisted Evolutionary Algorithm

50 GHz mm-Wave CMOS Active Inductor

Classifying text documents using unconventional representation

A comparison of CUDA and OpenACC: Accelerating the Tsunami Simulation EasyWave

Modeling steep slope devices: From circuits to architectures

Nonlinear Stress Analysis of Cable-Pylon Anchorage Zones RC of Extra-Dosed Cable-Stayed Bridge in Railway

Fast and fine-grained counting and identification via constructive interference in WSNs