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Analytical Study of Global Mobile Market: Forecasting and Substitution
Publisher: IEEE
Year: 2014
Through the wall imaging based on Time Reversal Independent Component Analysis
Publisher: IEEE
Year: 2014
Efficient computation of post-slot interactions in complex layered media with vertical interconnects
Publisher: IEEE
Year: 2014
λ-Size ITO and Graphene-Based Electro-Optic Modulators on SOI
Publisher: IEEE
Year: 2014
A Proactive Customer-Aware Resource Allocation Approach for Data Centers
Publisher: IEEE
Year: 2014
Electrical and compositional characterization of gallium grading in Cu(In,Ga)Se<inf>2</inf> solar cells
Publisher: IEEE
Year: 2014
Data-driven multisubject neuroimaging analyses for naturalistic stimuli
Publisher: IEEE
Year: 2014
Content management systems for mobile, context-dependent augmented reality applications
Publisher: IEEE
Year: 2014
Using an OpenCL framework to evaluate interconnect implementations on FPGAs
Publisher: IEEE
Year: 2014