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    Effect of partition coefficient on microsegregation during solidification of aluminium alloys 

    Type: Journal Paper
    Author : محمدحسن عوض کننده قراول; محسن حدادسبزوار; Prof. Hasse Fredriksson; Mohammad Hasan Avazkonandeh Gharavol; Mohsen Haddad Sabzevar
    Year: 2014
    Abstract:

    In the modeling of microsegregation, the partition coefficient is usually calculated using data from the equilibrium phase diagrams.The aim of this study was to experimentally and theoretically analyze the partition coefficient in binary aluminum–copper...

    The Electrical Specific Action to Melt of Structural Copper and Aluminum Alloys 

    Type: Journal Paper
    Author : Vanderburg, Andrew; Stefani, Francis; Sitzman, Alex; Crawford, Melba; Surls, Dwayne; Ling, Charles; McDonald, John
    Publisher: IEEE
    Year: 2014

    Effect of Nanocrystallization on Magnetic Properties and GMI Effect of Microwires 

    Type: Journal Paper
    Author : Zhukov, Arcady P.; Talaat, Ahmed; Ipatov, Mihail; Blanco, Juan M.; Gonzalez-Legarreta, Lorena; Hernando, Blanca; Zhukova, Valentina
    Publisher: IEEE
    Year: 2014

    FAA jurisdiction to regulate UAS operations below minimum altitudes and outside of navigable airspace 

    Type: Conference Paper
    Author : Copley, J.R.
    Publisher: IEEE
    Year: 2014

    Arc flash hazard reduction at incoming terminals of LV equipment 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Characterization and Reliability of Sintered Nanosilver Joints by a Rapid Current-Assisted Method for Power Electronics Packaging 

    Type: Journal Paper
    Author : Yun-Hui Mei; Yunjiao Cao; Gang Chen; Xin Li; Guo-Quan Lu; Xu Chen
    Publisher: IEEE
    Year: 2014

    Magnetic Field Effect on Magnetic and Electrical Properties of <formula formulatype="inline"> <img src="/images/tex/21328.gif" alt="{\\hbox {Mn}}_{2\\hbox {-}{\\rm x}}{\\hbox {Cu}}_{\\rm x}{\\hbox {Sb}}"> </formula> 

    Type: Journal Paper
    Author : Matsumoto, Yuki; Orihashi, Hiroki; Matsubayashi, K.; Uwatoko, Y.; Hiroi, Masahiko; Koyama, Koichi
    Publisher: IEEE
    Year: 2014

    Improvement of Electrochemical Migration Resistance by Cu/Sn Intermetallic Compound Barrier on Cu in Printed Circuit Board 

    Type: Journal Paper
    Author : Min-Suk Jung; Shin-Bok Lee; Ho-Young Lee; Chang-Sup Ryu; Young-Gwan Ko; Hyung-Wook Park; Young-Chang Joo
    Publisher: IEEE
    Year: 2014

    Influence of Rotor-Sleeve Electromagnetic Characteristics on High-Speed Permanent-Magnet Generator 

    Type: Journal Paper
    Author : Weili Li; Hongbo Qiu; Xiaochen Zhang; Junci Cao; Sainan Zhang; Ran Yi
    Publisher: IEEE
    Year: 2014

    Using Statistics of Extremes for Electromigration and Time-Dependent Dielectric Breakdown 

    Type: Journal Paper
    Author : Blonkowski, S.; Bana, F.; Ney, D.
    Publisher: IEEE
    Year: 2014
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