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نمایش تعداد 1-10 از 10

Adaptive Generalized Likelihood Ratio Chart for Monitoring the Process Mean

نوع: Conference Paper

نویسنده : REZA, SHOKRIZADEH; ABBAS, SAGHAEI; VAHID, AMIRZADEH

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The variable parameters T 2 chart with run rules

نوع: Journal Paper

ناشر: Springer

سال: 2014

A Reputation System Resisting to Undercover Marketing

نوع: Conference Paper

نویسنده : Sato, Fumiaki

ناشر: IEEE

سال: 2014

Simultaneous acquisition of high-rate early, middle, and late auditory evoked potentials

نوع: Conference Paper

نویسنده : Holt, F.D.; Ozdamar, O.

ناشر: IEEE

سال: 2014

Cost and yield analysis of multi-die packaging using 2.5D technology compared to fan-out wafer level packaging

نوع: Conference Paper

نویسنده : Palesko, Chet; Palesko, Amy; Vardaman, E.Jan

ناشر: IEEE

سال: 2014

Peening surface integrity of different milling conditions for high strength aluminum alloy 7055

نوع: Conference Paper

نویسنده : Changfeng Yao , Yongxia Du

ناشر: IEEE

سال: 2014

To the Point: A Shortcut to Essential Learning

نوع: Conference Paper

نویسنده : Kawase, R. , Siehndel, P. , Pereira Nunes, B.

ناشر: IEEE

سال: 2014

Interference aware massive SDMA with a large uniform rectangular antenna array

نوع: Conference Paper

نویسنده : Kurras, M. , Thiele, L. , Haustein, T.

ناشر: IEEE

سال: 2014

Poster: Comparison of RAN technologies for delay-tolerant downloads in vehicular networks

نوع: Conference Paper

نویسنده : Riihijarvi, J.; Lambrechts, S.; Mahonen, P.

ناشر: IEEE

سال: 2014

Accountable Health Care Service Provisioning in the Cloud

نوع: Conference Paper

نویسنده : Bernsmed, Karin

ناشر: IEEE

سال: 2014

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Adaptive Generalized Likelihood Ratio Chart for Monitoring the Process Mean

The variable parameters T 2 chart with run rules

A Reputation System Resisting to Undercover Marketing

Simultaneous acquisition of high-rate early, middle, and late auditory evoked potentials

Cost and yield analysis of multi-die packaging using 2.5D technology compared to fan-out wafer level packaging

Peening surface integrity of different milling conditions for high strength aluminum alloy 7055

To the Point: A Shortcut to Essential Learning

Interference aware massive SDMA with a large uniform rectangular antenna array

Poster: Comparison of RAN technologies for delay-tolerant downloads in vehicular networks

Accountable Health Care Service Provisioning in the Cloud

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Adaptive Generalized Likelihood Ratio Chart for Monitoring the Process Mean

The variable parameters T 2 chart with run rules

A Reputation System Resisting to Undercover Marketing

Simultaneous acquisition of high-rate early, middle, and late auditory evoked potentials

Cost and yield analysis of multi-die packaging using 2.5D technology compared to fan-out wafer level packaging

Peening surface integrity of different milling conditions for high strength aluminum alloy 7055

To the Point: A Shortcut to Essential Learning

Interference aware massive SDMA with a large uniform rectangular antenna array

Poster: Comparison of RAN technologies for delay-tolerant downloads in vehicular networks

Accountable Health Care Service Provisioning in the Cloud