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    Aperture coupled MEMS reconfigurable pixel patch antenna for conformal load bearing antenna structures (CLAS) 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Message from the IEEE Intercloud 2014 Workshop Co-Chairs 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    A Novel Model-Based Controller for Polymer Extrusion 

    Type: Journal Paper
    Author : Abeykoon, Chamil
    Publisher: IEEE
    Year: 2014

    A Novel Soft Sensor for Real-Time Monitoring of the Die Melt Temperature Profile in Polymer Extrusion 

    Type: Journal Paper
    Author : Abeykoon, Chamil
    Publisher: IEEE
    Year: 2014

    Thermal Monitoring of Eyjafjöll Volcano Eruptions by Means of Infrared MODIS Data 

    Type: Journal Paper
    Author : Lacava, Teodosio; Marchese, Francesco; Arcomano, Gianluca; Coviello, Irina; Falconieri, Alfredo; Faruolo, Mariapia; Pergola, Nicola; Tramutoli, Valerio
    Publisher: IEEE
    Year: 2014

    5 &#215; 5 scattered temperature sensor front-end based on single-doide with non-trimmed &#177;0.7&#176;C 3<italic>&#963;</italic> relative inaccuracy 

    Type: Journal Paper
    Author : Vosooghi, Bozorgmehr; Li Lu; Changzhi Li
    Publisher: IET
    Year: 2014

    Case Study of a Mobile HTML5 Multiplayer Game Portal 

    Type: Conference Paper
    Author : Carvalho, Leonardo V.de; Moreira, Atila Valgueiro Malta; Moreira, Icaro V.M.; Albuquerque, Marco Tulio C.F.; Filho, Vicente Vieira; Ramalho, Geber Lisboa
    Publisher: IEEE
    Year: 2014

    A 0.010mm<sup>2</sup> 9.92ps<inf>rms</inf> low tracking jitter pixel clock generator with a divider initializer and a nearest phase selector in 28nm CMOS technology 

    Type: Conference Paper
    Author : Kangyeop Choo; Sung-Jin Kim; Wooseok Kim; Jihyun Kim; Taeik Kim; Hojin Park
    Publisher: IEEE
    Year: 2014

    All-Electrical Thermal Monitoring of Terahertz Quantum Cascade Lasers 

    Type: Journal Paper
    Author : Krall, M.; Bachmann, D.; Deutsch, C.; Brandstetter, M.; Detz, H.; Andrews, A.M.; Schrenk, W.; Strasser, G.; Unterrainer, K.
    Publisher: IEEE
    Year: 2014

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