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RISComparison of spreading behaviour and interfacial microstructure in Sn 0آ·7Cu, Sn 0آ·3Ag 0آ·7Cu and Sn 2آ·5Ag 0آ·5Cu lead free solder alloys on Fe 42Ni substrate
Publisher: Institute of Materials, Minerals and Mining
Year: 2013
Solder joint reliability of Sn 0آ·7Cu and Sn 0آ·3Ag 0آ·7Cu lead free solder alloys solidified on copper substrates with different surface roughnesses
Publisher: Institute of Materials, Minerals and Mining
Year: 2013
Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe–Ni Solder Joints
Publisher: Allerton Press Inc
Year: 2014
Very high gain three-phase indirect matrix converter with two Z-source networks in its structure
Year: 2017
Abstract:
Nowadays, expansion of new energy sources and the necessity of integrating them with the utility grid require more advanced power electronic converters. Matrix converters (MCs) and indirect matrix converters (IMCs) are recent solutions, which offer...
A novel low-cost microcontroller-based implementation of SVM algorithm for an indirect matrix converter
Year: 2019
Abstract:
Modulation algorithms of indirect matrix converters -IMCs- are complicated and need powerful
processors, such as DSP along with FPGA or CPLD for implementation. Using any extra hardware
increases the cost and complexity and also reduces...