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Real time FITR spectroscopic and kinetic studies of Cu surface reduction by using formic acid vapor

Type: Conference Paper

Author : Chia-Chen Kuo , Jenn-Ming Song

Publisher: IEEE

Year: 2014

Novel metrology and wafer grinder technologies combine for improved capability for TSV structures

Type: Conference Paper

Publisher: IEEE

Year: 2014

A new non-isolated multi-output converter with four outputs from two switches

Type: Conference Paper

Publisher: IEEE

Year: 2014

Hardware virtualization based security solution for embedded systems

Type: Conference Paper

Publisher: IEEE

Year: 2014

An InGaAs/InP quantum well finfet using the replacement fin process integrated in an RMG flow on 300mm Si substrates

Type: Conference Paper

Publisher: IEEE

Year: 2014

3D rectangular waveguide integrated in embedded Wafer Level Ball Grid Array (eWLB) package

Type: Conference Paper

Publisher: IEEE

Year: 2014

Adaptive partitioning strategies for loop parallelism in heterogeneous architectures

Type: Conference Paper

Publisher: IEEE

Year: 2014

DfST: Design for secure testability

Type: Conference Paper

Author : Saeed, Samah Mohamed

Publisher: IEEE

Year: 2014

An algorithm to extract the generalized physical contradiction

Type: Conference Paper

Author : Lei Lin , Dubois, S. , De Guio, R. , Rasovska, I.

Publisher: IEEE

Year: 2014

Collaboration in the Absence of Communication

Type: Conference Paper

Author : Bendix, L.; Pendleton, C.

Publisher: IEEE

Year: 2014

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Real time FITR spectroscopic and kinetic studies of Cu surface reduction by using formic acid vapor

Novel metrology and wafer grinder technologies combine for improved capability for TSV structures

A new non-isolated multi-output converter with four outputs from two switches

Hardware virtualization based security solution for embedded systems

An InGaAs/InP quantum well finfet using the replacement fin process integrated in an RMG flow on 300mm Si substrates

3D rectangular waveguide integrated in embedded Wafer Level Ball Grid Array (eWLB) package

Adaptive partitioning strategies for loop parallelism in heterogeneous architectures

DfST: Design for secure testability

An algorithm to extract the generalized physical contradiction

Collaboration in the Absence of Communication

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Real time FITR spectroscopic and kinetic studies of Cu surface reduction by using formic acid vapor

Novel metrology and wafer grinder technologies combine for improved capability for TSV structures

A new non-isolated multi-output converter with four outputs from two switches

Hardware virtualization based security solution for embedded systems

An InGaAs/InP quantum well finfet using the replacement fin process integrated in an RMG flow on 300mm Si substrates

3D rectangular waveguide integrated in embedded Wafer Level Ball Grid Array (eWLB) package

Adaptive partitioning strategies for loop parallelism in heterogeneous architectures

DfST: Design for secure testability

An algorithm to extract the generalized physical contradiction

Collaboration in the Absence of Communication