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    Rapid thermal processing of Cu<inf>2</inf>ZnSnSe<inf>4</inf> thin films 

    Type: Conference Paper
    Author : Fairbrother, A.; Fourdrinier, L.; Fontane, X.; Izquierdo-Roca, V.; Dimitrievska, M.; Perez-Rodriguez, A.; Saucedo, E.
    Publisher: IEEE
    Year: 2014

    Hybrid genetic algorithm &#x2014; Artificial neural network classifier for skin cancer detection 

    Type: Conference Paper
    Author : Aswin, R.B; Jaleel, J.Abdul; Salim, Sibi
    Publisher: IEEE
    Year: 2014

    Evaluaci&#x00F3;n y diagn&#x00F3;stico de fallas en una trefiladora industrial 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Fine-grained object recognition with Gnostic Fields 

    Type: Conference Paper
    Author : Kanan, C.
    Publisher: IEEE
    Year: 2014

    Telemedicine system for game-based rehabilitation of stroke patients in the FP7-&#x201C;StrokeBack&#x201D; project 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Influence of compliant layer thickness on stress and strain of solder joints in wafer level chip scale package under thermal cycle 

    Type: Conference Paper
    Author : Liang Ying; Huang Chunyue; Zhang Xin; Li Tianming; Guo Guangkuo; Xiong Guoji; Tang Wenliang
    Publisher: IEEE
    Year: 2014

    Energy losses analysis of charged particle moving in inhomogeneous medium 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Music-AR: Software for teaching children music perception 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Big Data: Big Promises for Information Security 

    Type: Conference Paper
    Author : Alguliyev, Rasim; Imamverdiyev, Yadigar
    Publisher: IEEE
    Year: 2014

    The optimization of undervoltage load shedding strategy 

    Type: Conference Paper
    Author : Li, Ye; Zhang, Baohui; Bo, Zhiqian
    Publisher: IEEE
    Year: 2014
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