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RISComparative Study of FinFETs versus 22nm Bulk CMOS technologies: SRAM Design Perspective
In this paper, FinFET devices are compared to
bulk CMOS technology by looking at the characteristics of both
devices and their challenges in nano-scale regimes. The effects of
process variations on these devices along...
Influence of chevron fin interruption on thermo-fluidic transport characteristics of nanofluid-cooled electronic heat sink
In the current study, the effects of different interruptions of fin on the transport characteristics of a nanofluid-cooled electronic heat sink with chevron shape are analyzed numerically. Seven interruptions of fin are explored and compared...
Experimental &Theoretical Investigation of Pressure Drop across Tube Bundle of a THPHE and Introducing a New Correlation
Hydrodynamic and thermal performance of a heat pipe heat exchanger depends on a number of parameters such as heat pipe diameter, bundle geometry, orientation, fin spacing and size, etc. In this paper experimental and theoretical research has been...
Domino logic designs for high-performance and leakage-tolerant applications
improvement of upto 20% compared to conventional domino logic circuits. For FinFET simulation TCAD
tools have been used....