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نمایش تعداد 1-8 از 8

Adaptation of the Morris method to multi-dimensional factors for air-launch-to-orbit separation

نوع: Conference Paper

نویسنده : Sohier, H. , Farges, J.-L. , Piet-Lahanier, H.

ناشر: IEEE

سال: 2014

Study of 3D SiP (system-in-package) module for package-on-package application using multi-layer PCB manufacturing process

نوع: Conference Paper

نویسنده : Liulin Hu; Zhu Jin; Xuejie Liao; Yaoguo Ouyang; Jinsheng Dong

ناشر: IEEE

سال: 2014

A short overview on imagery interpretability rating scales

نوع: Conference Paper

نویسنده : Kreitmair, T.

ناشر: IEEE

سال: 2014

Definition of local integrity heat map

نوع: Conference Paper

نویسنده : Kaplan, E. , Peker, A.U. , Par, K. , Acarman, T.

ناشر: IEEE

سال: 2014

Radiation response of the fill-factor for GaAs solar cells with InGaAs quantum dot layers

نوع: Conference Paper

نویسنده : Nakamura, T.; Sumita, T.; Imaizumi, M.; Sugaya, T.; Matsubara, K.; Niki, S.; Mochizuki, T.; Takeda, A.; Okano, Y.; Sato, S.-I.; Ohshima, T.

ناشر: IEEE

سال: 2014

Performance of Selection Combining for Differential Amplify-and-Forward Relaying Over Time-Varying Channels

نوع: Journal Paper

نویسنده : Avendi, M.R.; Nguyen, Ha H.

ناشر: IEEE

سال: 2014

Cost-Aware Network Hardening with Limited Budget Using Compact Attack Graphs

نوع: Conference Paper

نویسنده : Yigit, Beytullah; Gur, Gurkan; Alagoz, Fatih

ناشر: IEEE

سال: 2014

A Low-Power, Low-Voltage WBAN-Compatible Sub-Sampling PSK Receiver in 65 nm CMOS

نوع: Journal Paper

نویسنده : Jiao Cheng; Nan Qi; Chiang, Patrick Yin; Natarajan, Arutselvan

ناشر: IEEE

سال: 2014

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Adaptation of the Morris method to multi-dimensional factors for air-launch-to-orbit separation

Study of 3D SiP (system-in-package) module for package-on-package application using multi-layer PCB manufacturing process

A short overview on imagery interpretability rating scales

Definition of local integrity heat map

Radiation response of the fill-factor for GaAs solar cells with InGaAs quantum dot layers

Performance of Selection Combining for Differential Amplify-and-Forward Relaying Over Time-Varying Channels

Cost-Aware Network Hardening with Limited Budget Using Compact Attack Graphs

A Low-Power, Low-Voltage WBAN-Compatible Sub-Sampling PSK Receiver in 65 nm CMOS

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Adaptation of the Morris method to multi-dimensional factors for air-launch-to-orbit separation

Study of 3D SiP (system-in-package) module for package-on-package application using multi-layer PCB manufacturing process

A short overview on imagery interpretability rating scales

Definition of local integrity heat map

Radiation response of the fill-factor for GaAs solar cells with InGaAs quantum dot layers

Performance of Selection Combining for Differential Amplify-and-Forward Relaying Over Time-Varying Channels

Cost-Aware Network Hardening with Limited Budget Using Compact Attack Graphs

A Low-Power, Low-Voltage WBAN-Compatible Sub-Sampling PSK Receiver in 65 nm CMOS