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    Microwave-Assisted Magnetization Reversal for Granular Media by a Resonant Cavity Method 

    Type: Journal Paper
    Author : Hinata, Shintaro; Saito, Sakuyoshi; Takahashi, Masaharu; Sahashi, Masashi
    Publisher: IEEE
    Year: 2014

    Magnetic Properties of Bilayer Ferromagnetic Shape Memory Ribbons 

    Type: Journal Paper
    Author : Sakoh, Nobuhiro; Todaka, Takashi; Enokizono, Masato
    Publisher: IEEE
    Year: 2014

    Exploratory Experiments in Recording on Sputtered Magnetic Tape at an Areal Density of 148 Gb/in<inline-formula> <tex-math notation="LaTeX">$^{textbf 2}$ </tex-math></inline-formula> 

    Type: Journal Paper
    Author : Tachibana, J.; Endo, T.; Hiratsuka, R.; Inoue, S.; Berman, D.; Jubert, P.-O.; Topuria, T.; Poon, C.; Imaino, W.
    Publisher: IEEE
    Year: 2014

    Joint layer based deep learning framework for bilingual machine transliteration 

    Type: Conference Paper
    Author : P, Sanjanaashree; M, Anand Kumar
    Publisher: IEEE
    Year: 2014

    Electronic and Magnetic Properties of (110) Films of Half-Metallic Heusler <formula formulatype="inline"> <img src="/images/tex/21297.gif" alt="{\\hbox {Fe}}_{2}{\\hbox {CrSi}}"> </formula> 

    Type: Journal Paper
    Author : Fujii, Shohei
    Publisher: IEEE
    Year: 2014

    Spin Polarization Measurements of Heusler Alloy <formula formulatype="inline"> <img src="/images/tex/21299.gif" alt="{\\hbox {Ru}}_{0.2}{\\hbox {Fe}}_{1.8}{\\hbox {CrSi}}"> </formula> by Andreev Reflection Technique 

    Type: Journal Paper
    Author : Shigeta, Iduru; Maeda, Yuji; Harumori, Kohei; Nishisako, Yuya; Ito, Minora; Yamauchi, Takashi; Hiroi, Masahiko
    Publisher: IEEE
    Year: 2014

    Design of an optimum soil moisture monitoring network using SMOS 

    Type: Conference Paper
    Author : Kornelsen, K.C.; Coulibaly, P.
    Publisher: IEEE
    Year: 2014

    Proposal of tool path generation for recycle pad in Chemical Mechanical Polishing based on piecewise linear interpolation method 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

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