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Now showing items 1-7 of 7
Numerical simulation of variations in the geomagnetic field of the earth
Publisher: IEEE
Year: 2014
Assembly and packaging of non-bumped 3D chip stacks on bumped substrates
Publisher: IEEE
Year: 2014
Bondgraph model for system of systems wireless communication link
Publisher: IEEE
Year: 2014
The iCub learns numbers: An embodied cognition study
Publisher: IEEE
Year: 2014
Performance Degradation of Various PV Module Technologies in Tropical Singapore
Publisher: IEEE
Year: 2014
CIGS Cells and Modules With High Efficiency on Glass and Flexible Substrates
Publisher: IEEE
Year: 2014