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نمایش تعداد 1-10 از 11

Effect of modulation structure on the laser-ignited self-propagating behavior of Ti/Al multilayer films

نوع: Conference Paper

نویسنده : Rong An; Yanhong Tian; Chunqing Wang

ناشر: IEEE

سال: 2014

Phase transformation and grain orientation of Cu–Sn intermetallic compounds during low temperature bonding process

نوع: Journal Paper

نویسنده : Chunjin Hang, Yanhong Tian, Rui Zhang…

سال: Year

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Mechanical properties and microstructure of Sn-based solder joints at cryogenic temperature

نوع: Conference Paper

نویسنده : Xue Du; Yanhong Tian; Xin Zhao

ناشر: IEEE

سال: 2014

Fatigue life prediction for CBGA under random vibration loading by finite element method

نوع: Conference Paper

نویسنده : Shang Wang; Yanhong Tian; Xuguang Guo

ناشر: IEEE

سال: 2014

Mechanical Properties and Fracture Mechanisms of Sn-3.0Ag-0.5Cu Solder Alloys and Joints at Cryogenic Temperatures

نوع: Journal Paper

نویسنده : Ruyu Tian; Yanhong Tian; Chenxi Wang; Liyou Zhao

سال: 2016

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Influence of aging treatment on deformation behavior of 96.5Sn3.5Ag lead-free solder alloy during in situ tensile tests

نوع: Journal Paper

نویسنده : Ying Ding; Chunqing Wang; Yanhong Tian; Mingyu Li

سال: 2007

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Research on tensile property and creep resistance of electroplating nickel reinforced by A1<inf>2</inf>O<inf>3</inf> nanoparticles

نوع: Conference Paper

نویسنده : Chunjin Hang; Yanhong Tian; Chunqing Wang; Hong Wang

ناشر: IEEE

سال: 2014

Parallel gap resistance thick wire bonding for vertical interconnection in 3D assembly

نوع: Conference Paper

نویسنده : Xuguang Guo; Yanhong Tian; Shang Wang; Chunqing Wang

ناشر: IEEE

سال: 2014

A novel method to fabricate AlN-Al<inf>2</inf>O<inf>3</inf> multiphase ceramic layer on WCu alloy

نوع: Conference Paper

نویسنده : Jiandong Zhu; Rong An; Chunqing Wang; Yanhong Tian; Guangwu Wen

ناشر: IEEE

سال: 2014

Shear fracture behavior of Sn3.0Ag0.5Cu solder joints on Cu pads with different solder volumes

نوع: Journal Paper

نویسنده : Yanhong Tian; Chunqing Wang; Shihua Yang; Penrong Lin; Le Liang

سال: 2008

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Effect of modulation structure on the laser-ignited self-propagating behavior of Ti/Al multilayer films

Phase transformation and grain orientation of Cu–Sn intermetallic compounds during low temperature bonding process

Mechanical properties and microstructure of Sn-based solder joints at cryogenic temperature

Fatigue life prediction for CBGA under random vibration loading by finite element method

Mechanical Properties and Fracture Mechanisms of Sn-3.0Ag-0.5Cu Solder Alloys and Joints at Cryogenic Temperatures

Influence of aging treatment on deformation behavior of 96.5Sn3.5Ag lead-free solder alloy during in situ tensile tests

Research on tensile property and creep resistance of electroplating nickel reinforced by A1<inf>2</inf>O<inf>3</inf> nanoparticles

Parallel gap resistance thick wire bonding for vertical interconnection in 3D assembly

A novel method to fabricate AlN-Al<inf>2</inf>O<inf>3</inf> multiphase ceramic layer on WCu alloy

Shear fracture behavior of Sn3.0Ag0.5Cu solder joints on Cu pads with different solder volumes

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Effect of modulation structure on the laser-ignited self-propagating behavior of Ti/Al multilayer films

Phase transformation and grain orientation of Cu–Sn intermetallic compounds during low temperature bonding process

Mechanical properties and microstructure of Sn-based solder joints at cryogenic temperature

Fatigue life prediction for CBGA under random vibration loading by finite element method

Mechanical Properties and Fracture Mechanisms of Sn-3.0Ag-0.5Cu Solder Alloys and Joints at Cryogenic Temperatures

Influence of aging treatment on deformation behavior of 96.5Sn3.5Ag lead-free solder alloy during in situ tensile tests

Research on tensile property and creep resistance of electroplating nickel reinforced by A1<inf>2</inf>O<inf>3</inf> nanoparticles

Parallel gap resistance thick wire bonding for vertical interconnection in 3D assembly

A novel method to fabricate AlN-Al<inf>2</inf>O<inf>3</inf> multiphase ceramic layer on WCu alloy

Shear fracture behavior of Sn3.0Ag0.5Cu solder joints on Cu pads with different solder volumes