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نمایش تعداد 1-7 از 7

A comparative reliability study of copper-plated glass vias, drilled with CO<inf>2</inf> and ArF excimer lasers

نوع: Conference Paper

نویسنده : Broas, Mikael; Demir, Kaya; Sato, Yoichiro; Sundaram, Venkatesh; Tummala, Rao

ناشر: IEEE

سال: 2014

Finite Element Analysis and Experiment Validation of Highly Reliable Silicon and Glass Interposers-to-Printed Wiring Board SMT Interconnections

نوع: Journal Paper

نویسنده : Xian Qin; Kumbhat, Nitesh; Raj, P. Markondeya; Sundaram, Venky; Tummala, Rao

ناشر: IEEE

سال: 2014

Analysis of Power Distribution Network in glass, silicon interposer and PCB

نوع: Conference Paper

نویسنده : Kim, Youngwoo; Cho, Kiyeong Kim Jonghyun; Kim, Joungho; Sundaram, Venky; Tummala, Rao

ناشر: IEEE

سال: 2014

Double-Side Process and Reliability of Through-Silicon Vias for Passive Interposer Applications

نوع: Journal Paper

نویسنده : Qiao Chen; Xi Liu; Sundaram, Venky; Sitaraman, Suresh K.; Tummala, Rao R.

ناشر: IEEE

سال: 2014

Ultraminiaturized WLAN RF Receiver Module in Thin Organic Substrate

نوع: Journal Paper

نویسنده : Sitaraman, Srikrishna; Suzuki, Yuya; Fuhan Liu; Kumbhat, Nitesh; Sung Jin Kim; Sundaram, Venky; Tummala, Rao

ناشر: IEEE

سال: 2014

Tunable and miniaturized RF components with nanocomposite and nanolayered dielectrics

نوع: Conference Paper

نویسنده : Raj, P.Markondeya; Chakraborti, Parthasarathi; Sharma, Himani; Han, KyuHwan; Gandhi, Saumya; Sitaraman, Srikrishna; Swaminathan, Madhavan; Tummala, Rao

ناشر: IEEE

سال: 2014

Design, Fabrication, and Characterization of Ultrathin 3-D Glass Interposers With Through-Package-Vias at Same Pitch as TSVs in Silicon

نوع: Journal Paper

نویسنده : Sukumaran, Vijay; Kumar, Girish; Ramachandran, Kishore; Suzuki, Yuya; Demir, Kubilay; Sato, Yuuki; Seki, Takaya; Sundaram, Venky; Tummala, Rao R.

ناشر: IEEE

سال: 2014

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A comparative reliability study of copper-plated glass vias, drilled with CO<inf>2</inf> and ArF excimer lasers

Finite Element Analysis and Experiment Validation of Highly Reliable Silicon and Glass Interposers-to-Printed Wiring Board SMT Interconnections

Analysis of Power Distribution Network in glass, silicon interposer and PCB

Double-Side Process and Reliability of Through-Silicon Vias for Passive Interposer Applications

Ultraminiaturized WLAN RF Receiver Module in Thin Organic Substrate

Tunable and miniaturized RF components with nanocomposite and nanolayered dielectrics

Design, Fabrication, and Characterization of Ultrathin 3-D Glass Interposers With Through-Package-Vias at Same Pitch as TSVs in Silicon

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A comparative reliability study of copper-plated glass vias, drilled with CO<inf>2</inf> and ArF excimer lasers

Finite Element Analysis and Experiment Validation of Highly Reliable Silicon and Glass Interposers-to-Printed Wiring Board SMT Interconnections

Analysis of Power Distribution Network in glass, silicon interposer and PCB

Double-Side Process and Reliability of Through-Silicon Vias for Passive Interposer Applications

Ultraminiaturized WLAN RF Receiver Module in Thin Organic Substrate

Tunable and miniaturized RF components with nanocomposite and nanolayered dielectrics

Design, Fabrication, and Characterization of Ultrathin 3-D Glass Interposers With Through-Package-Vias at Same Pitch as TSVs in Silicon