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نمایش تعداد 1-6 از 6

On the computation of power in VIE scattering and radiation calculations

نوع: Conference Paper

ناشر: IEEE

سال: 2014

Extended Layered Depth Image Representation in Multiview Navigation

نوع: Journal Paper

نویسنده : Takyar, Uday; Maugey, Thomas; Frossard, Pascal

ناشر: IEEE

سال: 2014

Technical issues and challenges in the fabrication of a 144-Cell 500× Concentrating Photovoltaic receiver

نوع: Conference Paper

نویسنده : Micheli, L.; Sarmah, N.; Fernandez, E.F.; Reddy, K.S.; Mallick, T.K.

ناشر: IEEE

سال: 2014

Flip-chip bonding alignment accuracy enhancement using self-aligned interconnection elements to realize low-temperature construction of ultrafine-pitch copper bump interconnections

نوع: Conference Paper

ناشر: IEEE

سال: 2014

Segmentation of ventricles in Alzheimer MR images using Tukey's biweight edge indicator and level set method

نوع: Conference Paper

نویسنده : Anandh, K R; Sujatha, C M; Ramakrishnan, S

ناشر: IEEE

سال: 2014

Dual trench gates SOI LIGBT with low conduction loss

نوع: Conference Paper

نویسنده : Meihua Liu; Jiang, F.X.C.; Xinnan Lin

ناشر: IEEE

سال: 2014

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On the computation of power in VIE scattering and radiation calculations

Extended Layered Depth Image Representation in Multiview Navigation

Technical issues and challenges in the fabrication of a 144-Cell 500× Concentrating Photovoltaic receiver

Flip-chip bonding alignment accuracy enhancement using self-aligned interconnection elements to realize low-temperature construction of ultrafine-pitch copper bump interconnections

Segmentation of ventricles in Alzheimer MR images using Tukey's biweight edge indicator and level set method

Dual trench gates SOI LIGBT with low conduction loss

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On the computation of power in VIE scattering and radiation calculations

Extended Layered Depth Image Representation in Multiview Navigation

Technical issues and challenges in the fabrication of a 144-Cell 500&#x00D7; Concentrating Photovoltaic receiver

Flip-chip bonding alignment accuracy enhancement using self-aligned interconnection elements to realize low-temperature construction of ultrafine-pitch copper bump interconnections

Segmentation of ventricles in Alzheimer MR images using Tukey's biweight edge indicator and level set method

Dual trench gates SOI LIGBT with low conduction loss

Technical issues and challenges in the fabrication of a 144-Cell 500× Concentrating Photovoltaic receiver