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نمایش تعداد 1-10 از 12
Equivalent circuit of multi-gap output cavity for sheet beam EIK
ناشر: IEEE
سال: 2014
Field Exposure and Dosimetry in the THz Frequency Range
ناشر: IEEE
سال: 2014
Is Conductive Adhesive Bonding Suited for the Die-Attachment of Power Devices?
ناشر: IEEE
سال: 2014
Analysis of substrate shielding methods for sub-THz on-chip inductors
ناشر: IET
سال: 2014
Optimizing Energy Consumption in Terahertz Band Nanonetworks
ناشر: IEEE
سال: 2014