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CU seed, CMP process development and via resistance extraction in through silicon via technology

Type: Conference Paper

Author : Zheng-Jun Hu; Xin-Ping Qu; Hong Lin; Ren-Dong Huang; Qing-Yun Zuo; Ming Li; Shou-Mian Chen; Yu-Hang Zhao

Publisher: IEEE

Year: 2014

Extraction of geometry-related interconnect variation based on parasitic capacitance data

Type: Journal Paper

Author : Li-Jie Sun; Jia Cheng; Zheng Ren; Gan-Bing Shang; Shao-Jian Hu; Shou-Mian Chen; Yu-Hang Zhao; Long Zhang; Xiao-Jin Li; Yan-Ling Shi

Publisher: IEEE

Year: 2014

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CU seed, CMP process development and via resistance extraction in through silicon via technology

Extraction of geometry-related interconnect variation based on parasitic capacitance data

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CU seed, CMP process development and via resistance extraction in through silicon via technology

Extraction of geometry-related interconnect variation based on parasitic capacitance data