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Now showing items 1-8 of 8

Lead-free Solder Interconnect Reliability

Type: Ebook

Author : Dongkai Shangguan

Year: 2005

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Cellular Growth of Crystals

Type: Ebook

Author : Dongkai Shangguan (auth.)

Publisher: Springer Berlin Heidelberg

Year: 1991

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Process development for 3D integration: Conductive wafer bonding for high density inter-chip interconnection

Type: Conference Paper

Author : Chongshen Song , Wenqi Zhang , Dongkai Shangguan

Publisher: IEEE

Year: 2014

Optimization design and simulation for a band-pass-filter with IPD technology for RF front-end application

Type: Conference Paper

Author : Huijuan Wang; Jie Pan; Xiaoli Ren; Anmou Liao; Yuan Lu; Daquan Yu; Dongkai Shangguan

Publisher: IEEE

Year: 2014

Modeling, simulation and analysis of coplanar waveguide on glass substrate for 2.5D integration

Type: Conference Paper

Author : Wenya Shang; Cheng Pang; Xiaoli Ren; Zheng Qin; Daquan Yu; Dongkai Shangguan

Publisher: IEEE

Year: 2014

Electrical simulation of thin film inductors on silicon and glass substrates

Type: Conference Paper

Author : Zheng Qin; Cheng Pang; Xiaoli Ren; Wenya Shang; Dongkai Shangguan; Daquan Yu

Publisher: IEEE

Year: 2014

Analysis on electromagnetic isolation issues among multi-chips in system in package

Type: Conference Paper

Author : Peng Wu; Fengman Liu; Yi He; Huimin He; Jun Li; Liqiang Cao; Dongkai Shangguan; Lixi Wan

Publisher: IEEE

Year: 2014

Circuit modeling and structure optimization of integrated passive inductors

Type: Conference Paper

Author : Jie Pan; Huijuan Wang; Delong Qiu; Xiaoli Ren; Yuan Lu; Daquan Yu; Dongkai Shangguan

Publisher: IEEE

Year: 2014

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Lead-free Solder Interconnect Reliability

Cellular Growth of Crystals

Process development for 3D integration: Conductive wafer bonding for high density inter-chip interconnection

Optimization design and simulation for a band-pass-filter with IPD technology for RF front-end application

Modeling, simulation and analysis of coplanar waveguide on glass substrate for 2.5D integration

Electrical simulation of thin film inductors on silicon and glass substrates

Analysis on electromagnetic isolation issues among multi-chips in system in package

Circuit modeling and structure optimization of integrated passive inductors

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Lead-free Solder Interconnect Reliability

Cellular Growth of Crystals

Process development for 3D integration: Conductive wafer bonding for high density inter-chip interconnection

Optimization design and simulation for a band-pass-filter with IPD technology for RF front-end application

Modeling, simulation and analysis of coplanar waveguide on glass substrate for 2.5D integration

Electrical simulation of thin film inductors on silicon and glass substrates

Analysis on electromagnetic isolation issues among multi-chips in system in package

Circuit modeling and structure optimization of integrated passive inductors