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    thermal characteristics of a two_phase closed thermosyphon 

    Type: Conference Paper
    Author : سیدحسین نوعی باغبان; Seyed Hossein Noie Baghban
    Year: 2002

    effect of aspect ratio and filling ratio on heat transfer characteristics of a two_phase closed ther 

    Type: Conference Paper
    Author : سیدحسین نوعی باغبان; Seyed Hossein Noie Baghban
    Year: 2000

    Effects of nanoparticle volume fraction in hydrodynamic and thermal characteristics of forced plane jet 

    Type: Journal Paper
    Author : محمد جواد مغربی; Taher Armaghani; F. Talebi; Mohammad Javad Maghrebi
    Year: 2012
    Abstract:

    The effects of nanoparticle volume fraction in hydrodynamic and thermal characteristics of an incompressible forced 2-D plane jet flow are investigated. Direct Numerical Simulation (DNS) of a two dimensional incompressible plane forced jet flow...

    Thermal Characteristics of a Tow-Phase Closed Thermosyphon ( مشخصات گرمایی یک ترموسیفون بسته دو فاز ) 

    Type: Conference Paper
    Author : سیدحسین نوعی باغبان; M.Kalaei; R. Sanati; Seyed Hossein Noie Baghban; M.Kalaei; R. Sanati
    Year: 2002
    Abstract:

    Thermal Characteristics of a Tow-Phase Closed Thermosyphon ( مشخصات گرمایی یک ترموسیفون بسته دو فاز )...

    Optical Pump Induced Thermal Sensitivity Reduction in a Minimized Er/Yb-Codoped-Fiber Mach–Zehnder Interferometer 

    Type: Journal Paper
    Author : Bo Dong; Nan-Kuang Chen; Gia-Ling Cheng; Changyuan Yu; Yandong Gong
    Publisher: IEEE
    Year: 2014

    Demonstration of Reduced Power Consumption MEMS LEL Sensor Prepared by a Novel Digital Microfluid Technique 

    Type: Journal Paper
    Author : Lin Yang; Zhimin Zhou
    Publisher: IEEE
    Year: 2014

    Prolog to "Rugged Electrical Power Switching in Semiconductors: A Systems Approach" 

    Type: Journal Paper
    Author : Esch, J.
    Publisher: IEEE
    Year: 2014

    Evaluation on Electrical and Thermal Characteristics of Multi-Stacked HTS Coated Conductor With Various Stabilizers 

    Type: Journal Paper
    Author : Young Gun Park; Young Jin Hwang; Jae Young Jang; Hyung Jun Kim; Woo Seung Lee; Hyun Chul Jo; Ho Min Kim; Yong Soo Yoon; Tae Kuk Ko
    Publisher: IEEE
    Year: 2014

    Investigation of Quilt Packaging Interchip Interconnect With Solder Paste 

    Type: Journal Paper
    Author : Quanling Zheng; Kopp, David; Khan, Muhammad Asad; Fay, Patrick; Kriman, Alfred M.; Bernstein, Gary H.
    Publisher: IEEE
    Year: 2014

    Optimal design of LLC resonant converter with improved controllability 

    Type: Conference Paper
    Author : Khoobroo, E. , Ashrafinia, B. , Akhbari, M.
    Publisher: IEEE
    Year: 2014
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