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Conversion of AgCI nanocubes to Ag/AgCI nanohybrids via solid-liquid reaction for surface-enhanced Raman scattering detection

Type: Journal Paper

Author : Fangling Cui; Muheng Zhai; Konglin Wu; Nan Yu; Zhenghua Wang

Publisher: IET

Year: 2014

Effect of reference electrode in the nanoFET (field-effect transistor)-based biosensor experiment

Type: Journal Paper

Author : Yeong-Tai Seo; Kuk Jin Jang; Min-Ho Lee; Woo-Kyeong Seong; Kook-Nyung Lee; Yong-Kweon Kim

Publisher: IET

Year: 2014

Thermomechanical Assessment of Die-Attach Materials for Wide Bandgap Semiconductor Devices and Harsh Environment Applications

Type: Journal Paper

Author : Navarro, Luis /A/.; Perpina, Xavier; Godignon, P.; Montserrat, J.; Banu, V.; Vellvehi, Miquel; Jorda, Xavier

Publisher: IEEE

Year: 2014

Impact of Skin–Electrode Interface on Electrocardiogram Measurements Using Conductive Textile Electrodes

Type: Journal Paper

Author : Taji, B.; Shirmohammadi, Shervin; Groza, V.; Batkin, Izmail

Publisher: IEEE

Year: 2014

Using augment reality to increase capacity in QR code

Type: Conference Paper

Author : Bunma, D. , Vongpradhip, S.

Publisher: IEEE

Year: 2014

Back channel etch oxide TFT on plastic substrate for the application of high resolution TFT-LCD

Type: Conference Paper

Publisher: IEEE

Year: 2014

Non-Linear 3D Impedance Spectroscopy

Type: Journal Paper

Author : Zamora, Martin Lucas; Trujillo, Ricardo Matias; Felice, Carmelo Jose

Publisher: IEEE

Year: 2014

One-step hydrothermal synthesis of the Ag/AgI heterojunction with highly enhanced visible-light photocatalytic performances

Type: Journal Paper

Author : Xinjun Wang; Xiaoli Wan; Wuqi Li; Xuenian Chen

Publisher: IET

Year: 2014

Preparation of Ag<sub>2</sub>SO<sub>3</sub> sub-microparticles with high visible-light photocatalytic activity

Type: Journal Paper

Author : Chao Dong; Kong-Lin Wu; Xian-Wen Wei; Jing Wang; Li Liu; Yu Hu; Shan-Hui Xia

Publisher: IET

Year: 2014

Finite Element Analysis and Experiment Validation of Highly Reliable Silicon and Glass Interposers-to-Printed Wiring Board SMT Interconnections

Type: Journal Paper

Author : Xian Qin; Kumbhat, Nitesh; Raj, P. Markondeya; Sundaram, Venky; Tummala, Rao

Publisher: IEEE

Year: 2014

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Conversion of AgCI nanocubes to Ag/AgCI nanohybrids via solid-liquid reaction for surface-enhanced Raman scattering detection

Effect of reference electrode in the nanoFET (field-effect transistor)-based biosensor experiment

Thermomechanical Assessment of Die-Attach Materials for Wide Bandgap Semiconductor Devices and Harsh Environment Applications

Impact of Skin–Electrode Interface on Electrocardiogram Measurements Using Conductive Textile Electrodes

Using augment reality to increase capacity in QR code

Back channel etch oxide TFT on plastic substrate for the application of high resolution TFT-LCD

Non-Linear 3D Impedance Spectroscopy

One-step hydrothermal synthesis of the Ag/AgI heterojunction with highly enhanced visible-light photocatalytic performances

Preparation of Ag<sub>2</sub>SO<sub>3</sub> sub-microparticles with high visible-light photocatalytic activity

Finite Element Analysis and Experiment Validation of Highly Reliable Silicon and Glass Interposers-to-Printed Wiring Board SMT Interconnections

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Conversion of AgCI nanocubes to Ag/AgCI nanohybrids via solid-liquid reaction for surface-enhanced Raman scattering detection

Effect of reference electrode in the nanoFET (field-effect transistor)-based biosensor experiment

Thermomechanical Assessment of Die-Attach Materials for Wide Bandgap Semiconductor Devices and Harsh Environment Applications

Impact of Skin&#x2013;Electrode Interface on Electrocardiogram Measurements Using Conductive Textile Electrodes

Using augment reality to increase capacity in QR code

Back channel etch oxide TFT on plastic substrate for the application of high resolution TFT-LCD

Non-Linear 3D Impedance Spectroscopy

One-step hydrothermal synthesis of the Ag/AgI heterojunction with highly enhanced visible-light photocatalytic performances

Preparation of Ag<sub>2</sub>SO<sub>3</sub> sub-microparticles with high visible-light photocatalytic activity

Finite Element Analysis and Experiment Validation of Highly Reliable Silicon and Glass Interposers-to-Printed Wiring Board SMT Interconnections

Impact of Skin–Electrode Interface on Electrocardiogram Measurements Using Conductive Textile Electrodes