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    A Delay Test Architecture for TSV With Resistive Open Defects in 3-D Stacked Memories 

    Type: Journal Paper
    Author : Hyungsu Sung; Keewon Cho; Kunsang Yoon; Sungho Kang
    Publisher: IEEE
    Year: 2014

    A Complete Resistive-Open Defect Analysis for Thermally Assisted Switching MRAMs 

    Type: Journal Paper
    Author : Azevedo, Joao; Virazel, A.; Bosio, A.; Dilillo, L.; Girard, P.; Todri-Sanial, Aida; Alvarez-Herault, Jeremy; Mackay, Ken
    Publisher: IEEE
    Year: 2014

    Bubble shape estimation in gas-liquid slug flow using wire-mesh sensor and advanced data processing 

    Type: Conference Paper
    Author : Santos, Eduardo N.; Pipa, Daniel R.; Morales, Rigoberto E.M.; da Silva, Marco J.
    Publisher: IEEE
    Year: 2014

    Ultrasound interactive segmentation with tensor-graph methods 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Efficient Variation-Aware Delay Fault Simulation Methodology for Resistive Open and Bridge Defects 

    Type: Journal Paper
    Author : Shida Zhong; Khursheed, Saqib; Al-Hashimi, B.M.; Wei Zhao
    Publisher: IEEE
    Year: 2014

    Possibility of a new type of wireless network: Connected small cells with 3G-LTE signaling primitives and PON for the backhaul 

    Type: Conference Paper
    Author : Yamada, Takahiko; Nishimura, Toshikazu
    Publisher: IEEE
    Year: 2014

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