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    Compressively-stressed test structures for opaque micro-stmctures releasing visualization 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Towards training-free appearance-based localization: Probabilistic models for whole-image descriptors 

    Type: Conference Paper
    Author : Lowry, S.M. , Wyeth, G.F. , Milford, M.J.
    Publisher: IEEE
    Year: 2014

    Design of a high order binaural microphone array for hearing aids using a rigid spherical model 

    Type: Conference Paper
    Author : Merks, I. , Buye Xu , Tao Zhang
    Publisher: IEEE
    Year: 2014

    Experimental evaluation of adhesive technologies for robotic grippers on micro-rough surfaces 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    A consensus-based decentralized emforamixture of factor analyzers 

    Type: Conference Paper
    Author : Whipps, Gene T.; Ertin, Emre; Moses, Randolph L.
    Publisher: IEEE
    Year: 2014

    An Overview of Advances in Automotive Electronics [Automotive Electronics] 

    Type: Journal Paper
    Author : Fleming, Bill
    Publisher: IEEE
    Year: 2014

    A column-row-parallel ultrasound imaging architecture for 3d plane-wave imaging and Tx 2nd-order harmonic distortion (HD2) reduction 

    Type: Conference Paper
    Author : Kailiang Chen; Byung Chul Lee; Thomenius, K.; Khuri-Yakub, B.T.; Hae-Seung Lee; Sodini, C.G.
    Publisher: IEEE
    Year: 2014

    Multivariate Network Exploration and Presentation: From Detail to Overview via Selections and Aggregations 

    Type: Journal Paper
    Author : van den Elzen, Stef; van Wijk, Jarke J.
    Publisher: IEEE
    Year: 2014

    Overview of Grounding and Configuration Options for Meshed HVDC Grids 

    Type: Journal Paper
    Author : Leterme, Willem; Tielens, Pieter; De Boeck, Steven; Van Hertem, Dirk
    Publisher: IEEE
    Year: 2014

    Application of resistance heater on experimental research of scramjet combustor 

    Type: Conference Paper
    Author : Song Wenyan , Shi Deyong , Fu Qiang , Wang Yanhua
    Publisher: IEEE
    Year: 2014
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