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    Fluidic self-assembly of multilayered tubular microstructures by axis translation inside two-layered microfluidic devices 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Mobile phone Icons recognition and cultural aspects 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Dynamic modeling and stabilization of quadrotor using PID controller 

    Type: Conference Paper
    Author : Khatoon, Shahida; Shahid, Mohammad; Ibraheem; Chaudhary, Himanshu
    Publisher: IEEE
    Year: 2014

    Investigation of capacity loss and mean effective gain in multiple antenna systems 

    Type: Conference Paper
    Author : Aouadi, Belgacem; Tahar, Jamel Belhadj
    Publisher: IEEE
    Year: 2014

    A dynamic opportunistic spectrum access MAC protocol for Cognitive Radio networks 

    Type: Conference Paper
    Author : Tripathi, Smit B; Shah, Mehul B
    Publisher: IEEE
    Year: 2014

    Wafer-Level Fabrication of Microcube-Typed Beam-Splitters by Saw-Dicing of Glass Substrate 

    Type: Journal Paper
    Author : Baranski, Marcin; Bargiel, Sylwester; Passilly, Nicolas; Guichardaz, B.; Herth, E.; Gorecki, Christophe; Chenping Jia; Fromel, J.; Wiemer, M.
    Publisher: IEEE
    Year: 2014

    Evanescent Wave Coupled Spectroscopic Sensing Using Smartphone 

    Type: Journal Paper
    Author : Dutta, Suparna; Choudhury, Alamgir; Nath, Pabitra
    Publisher: IEEE
    Year: 2014

    Dual Mach-Zehnder Based Integrated X-Type Ratiometric Wavelength Monitor on Glass 

    Type: Journal Paper
    Author : Bing Yang; Weicheng Shi; Chongyang Pei; Hui Yu; Xiaoqing Jiang; Yinlei Hao; Yubo Li; Jianyi Yang
    Publisher: IEEE
    Year: 2014

    A sparse integrative cluster analysis for understanding soybean phenotypes 

    Type: Conference Paper
    Author : Bi, Jinbo; Sun, Jiangwen; Xu, Tingyang; Lu, Jin; Ma, Yansong; Qiu, Lijuan
    Publisher: IEEE
    Year: 2014

    Fast analytical model of switched reluctance machine 

    Type: Conference Paper
    Author : Smaka, S. , Masic, S. , Cosovic, M.
    Publisher: IEEE
    Year: 2014
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