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Reliability testing of electrically conductive joints made of sintered nano silver
Publisher: IEEE
Year: 2014
The Behavior of SEE Sensitivity at Various TID Levels
Publisher: IEEE
Year: 2014
Single-Event Effects in Low-Cost, Low-Power Microprocessors
Publisher: IEEE
Year: 2014
EMC analysis for Multi-point grounding cable of aircraft
Publisher: IEEE
Year: 2014
Performance of a hybrid AC/DC microgrid using RES and super capacitor in grid connected and islanded mode
Publisher: IEEE
Year: 2014
Babies: Biometric authentication of newborn identities by means of ear signatures
Publisher: IEEE
Year: 2014