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Novel spray coating process with polymer material applied in CIS wafer-level-packaging

Type: Conference Paper

Author : Zhuang, Yuechen; Yu, Daquan; Dai, Fengwei; Niu, Zhongcai; Zhang, Wenqi; Yong, Zhenzhong; Zhang, Guoping

Publisher: IEEE

Year: 2014

Digital compensation method for the path delay mismatches in GRO-TDC

Type: Conference Paper

Author : Park, Pyoungwon; Nag, Dipankar; Dan Lei, Yan; Arasu, Muthukumaraswamy Annamalai

Publisher: IEEE

Year: 2014

List reviewer

Type: Conference Paper

Publisher: IEEE

Year: 2014

Author

Arasu, Muthukumaraswamy Annamalai (1)

Dai, Fengwei (1)

Dan Lei, Yan (1)

Nag, Dipankar (1)

Niu, Zhongcai (1)

Park, Pyoungwon (1)

Yong, Zhenzhong (1)

Yu, Daquan (1)

Zhang, Guoping (1)

Zhang, Wenqi (1)

Publisher

IEEE (3)

Year

2014 (3)

Keywords

n Ontologies (3)

Ad hoc networks (1)

Algorithm design and analysis (1)

educational administrative data processing (1)

n 23bits (1)

n Algorithm design and analysis (1)

n Big data (1)

n Big Data Processing (1)

n Bounded Rationality (1)

n Clustering (1)

Type

Conference Paper (3)

Language (ISO)

English (3)

Content Type

Metadata Only (3)

Publication Title

lectronics Packaging Technology Conference (EPTC), 2014 IEEE 16th (1)

nformation and Communication Technology for The Muslim World (ICT4M), 2014 The 5th International Con (1)

ntegrated Circuits (ISIC), 2014 14th International Symposium on (1)

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