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Now showing items 1-10 of 12

Single & multi beam laser grooving process parameter development and die strength characterization for 40nm node low-K/ULK wafer

Type: Conference Paper

Author : Shi, Koh Wen; Yow, K.Y.; Lo, Calvin

Publisher: IEEE

Year: 2014

The hybrid frequency synthesizer based on DDS and two-loop PLL

Type: Conference Paper

Author : Romashov, V.V.; Khramov, K.K.; Yakimenko, K.A.

Publisher: IEEE

Year: 2014

Reactive power dispatch for loss minimization of a Doubly fed induction generator based wind farm

Type: Conference Paper

Author : Baohua Zhang; Weihao Hu; Peng Hou; Zhe Chen

Publisher: IEEE

Year: 2014

From Task Graphs to Concrete Actions: A New Task Mapping Algorithm for the Future Internet of Things

Type: Conference Paper

Author : Billet, Benjamin; Issarny, Valerie

Publisher: IEEE

Year: 2014

The front-end electronics and the data acquisition system for a kinetic inductance detector

Type: Conference Paper

Author : Branchini, Paolo; Aloisio, Alberto

Publisher: IEEE

Year: 2014

Prognostic indicators for Cu-Al wirebond degradation under operation at elevated temperature and combined temperature humidity

Type: Conference Paper

Author : Lall, Pradeep; Deshpande, Shantanu; Luu Nguyen; Murtuza, Masood

Publisher: IEEE

Year: 2014

Fabrication of cylindrical micro-components using laser scan lithography and electrolytic etching of stainless steel pipes

Type: Conference Paper

Author : Horiuchi, Toshiyuki; Sakabe, Hiroshi; Sano, Takaaki

Publisher: IEEE

Year: 2014

Linear Input Method of Mathematical Formula

Type: Conference Paper

Author : Ming Cheng; Wei Su; Yuexia Xu; Zhiyi Qu; Xuan Wang

Publisher: IEEE

Year: 2014

Control of bank-to-turn missiles using a combination of first order and dynamic sliding mode control

Type: Conference Paper

Author : Sebastian, T.; Jacob, J.

Publisher: IEEE

Year: 2014

IR polarimetry using compact circular polarized IR antennas integrated with InGaAsSb Nano-load

Type: Conference Paper

Author : Choi, Sangjo; Sarabandi, Kamal

Publisher: IEEE

Year: 2014

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Single & multi beam laser grooving process parameter development and die strength characterization for 40nm node low-K/ULK wafer

The hybrid frequency synthesizer based on DDS and two-loop PLL

Reactive power dispatch for loss minimization of a Doubly fed induction generator based wind farm

From Task Graphs to Concrete Actions: A New Task Mapping Algorithm for the Future Internet of Things

The front-end electronics and the data acquisition system for a kinetic inductance detector

Prognostic indicators for Cu-Al wirebond degradation under operation at elevated temperature and combined temperature humidity

Fabrication of cylindrical micro-components using laser scan lithography and electrolytic etching of stainless steel pipes

Linear Input Method of Mathematical Formula

Control of bank-to-turn missiles using a combination of first order and dynamic sliding mode control

IR polarimetry using compact circular polarized IR antennas integrated with InGaAsSb Nano-load

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Single &amp; multi beam laser grooving process parameter development and die strength characterization for 40nm node low-K/ULK wafer

The hybrid frequency synthesizer based on DDS and two-loop PLL

Reactive power dispatch for loss minimization of a Doubly fed induction generator based wind farm

From Task Graphs to Concrete Actions: A New Task Mapping Algorithm for the Future Internet of Things

The front-end electronics and the data acquisition system for a kinetic inductance detector

Prognostic indicators for Cu-Al wirebond degradation under operation at elevated temperature and combined temperature humidity

Fabrication of cylindrical micro-components using laser scan lithography and electrolytic etching of stainless steel pipes

Linear Input Method of Mathematical Formula

Control of bank-to-turn missiles using a combination of first order and dynamic sliding mode control

IR polarimetry using compact circular polarized IR antennas integrated with InGaAsSb Nano-load

Single & multi beam laser grooving process parameter development and die strength characterization for 40nm node low-K/ULK wafer