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    Development of TLP joining technique for fabrication of vertical interconnections in TSV stacking 

    Type: Conference Paper
    Author : Denteneer, R.P.J.; Krassenburg, L.C.P.; Brom, J.H.G.; Biglari, M.H.
    Publisher: IEEE
    Year: 2014

    Text content analysis using ontology and semantic similarity 

    Type: Conference Paper
    Author : Prodanovic, D.; Furlan, B.; Nikolic, B.
    Publisher: IEEE
    Year: 2014

    How much overhead is required for stable group formation in VANETs? 

    Type: Conference Paper
    Author : Sucasas, Victor; Radwan, Ayman; Marques, Hugo; Rodriguez, Jonathan; Vahid, Seiamak; Tafazolli, Rahim
    Publisher: IEEE
    Year: 2014

    Detecting walking pedestrians from leg motion in driving video 

    Type: Conference Paper
    Author : Kilicarslan, M.; Zheng, J.Y.
    Publisher: IEEE
    Year: 2014

    A Selective Erasure Channel Model for Packet Collision Channels within Wireless Sensor Networks 

    Type: Conference Paper
    Author : Elshabrawy, Tallal
    Publisher: IEEE
    Year: 2014

    A Better Case Adaptation Method for Case-Based Effort Estimation Using Multi-objective Optimization 

    Type: Conference Paper
    Author : Nassif, Ali Bou; Banitaan, Shadi
    Publisher: IEEE
    Year: 2014

    Tool Machines with Brains - Touchless Wheel Alignment with Neural Networks 

    Type: Conference Paper
    Author : Weis, Karl-Heinz
    Publisher: IEEE
    Year: 2014

    Accuracy limitation of wind speed altimetric measurements 

    Type: Conference Paper
    Author : Zapevalov, A.S.; Pustovoytenko, V.V.
    Publisher: IEEE
    Year: 2014

    Adaptive subthreshold switched capacitor voltage boost for thermoelectric generation 

    Type: Conference Paper
    Author : Brito, Rene; Barba, Mauricio; Palakurthi, Praveen; Nemir, David; MacDonald, Eric
    Publisher: IEEE
    Year: 2014

    Design and characterization of radiation-tolerant CMOS 4T Active Pixel Sensors 

    Type: Conference Paper
    Author : Qian, Xinyuan; Yu, Hang; Chen, Shoushun; Low, Kay Soon
    Publisher: IEEE
    Year: 2014
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