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High temperature die attach material on ENEPIG surface for high temperature (250DegC/500hour) and temperature cycle (−65 to +150DegC) applications

Type: Conference Paper

Author : Wai, Leong Ching; Wei, Seit Wen; Yuan, Hwang How; MinWoo, Daniel Rhee

Publisher: IEEE

Year: 2014

Space charge behaviours in polyethylene under combined AC and DC electric fields

Type: Conference Paper

Author : Zhou, C.; Chen, G.

Publisher: IEEE

Year: 2014

A cooperative Q-learning approach for distributed resource allocation in multi-user femtocell networks

Type: Conference Paper

Author : Saad, Hussein; Mohamed, Amr; ElBatt, Tamer

Publisher: IEEE

Year: 2014

Virtual energy simulation of induction traction drive test bench

Type: Conference Paper

Author : Stana, Girts; Apse-Apsitis, Peteris; Brazis, Viesturs

Publisher: IEEE

Year: 2014

Seal effects on wireless power transfer systems via magnetic resonance coupling

Type: Conference Paper

Author : Shi, Xinzhi; Qi, Chang; Qu, Meiling; Shi, Zhenhua; Xu, Houxiang

Publisher: IEEE

Year: 2014

Further reduction of switching loss for the lossless snubber based converters

Type: Conference Paper

Author : Wang, Beibei; Zheng, Trillion Q; Zhang, Jiepin

Publisher: IEEE

Year: 2014

Analysis on influential factors of integrated innovation of industry-university-institute cooperation from relationship perspective

Type: Conference Paper

Author : Yuan, Teng; Zhou, Jianlin; Wang, Guohong

Publisher: IEEE

Year: 2014

A simplified wind farm simulation method for LVRT capability assessment

Type: Conference Paper

Author : Chen, Ziyu; He, Jing; Wang, Dongjun; Li, Qing; Qin, Shiyao

Publisher: IEEE

Year: 2014

Distributed energy management in smart grid with dominated electricity provider and multiple microgrids

Type: Conference Paper

Author : Bai, Jinfang; Zhou, Zhenyu; Zhou, Sheng; Tariq, Muhammad

Publisher: IEEE

Year: 2014

VSC based DC grid power flow algorithm and AC/DC power flow algorithm

Type: Conference Paper

Author : Chen, Xing Lei; Zhao, Zheng; Zi, Peng; Zhou, Xiao Xin

Publisher: IEEE

Year: 2014

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High temperature die attach material on ENEPIG surface for high temperature (250DegC/500hour) and temperature cycle (−65 to +150DegC) applications

Space charge behaviours in polyethylene under combined AC and DC electric fields

A cooperative Q-learning approach for distributed resource allocation in multi-user femtocell networks

Virtual energy simulation of induction traction drive test bench

Seal effects on wireless power transfer systems via magnetic resonance coupling

Further reduction of switching loss for the lossless snubber based converters

Analysis on influential factors of integrated innovation of industry-university-institute cooperation from relationship perspective

A simplified wind farm simulation method for LVRT capability assessment

Distributed energy management in smart grid with dominated electricity provider and multiple microgrids

VSC based DC grid power flow algorithm and AC/DC power flow algorithm

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High temperature die attach material on ENEPIG surface for high temperature (250DegC/500hour) and temperature cycle (&#x2212;65 to &#x002B;150DegC) applications

Space charge behaviours in polyethylene under combined AC and DC electric fields

A cooperative Q-learning approach for distributed resource allocation in multi-user femtocell networks

Virtual energy simulation of induction traction drive test bench

Seal effects on wireless power transfer systems via magnetic resonance coupling

Further reduction of switching loss for the lossless snubber based converters

Analysis on influential factors of integrated innovation of industry-university-institute cooperation from relationship perspective

A simplified wind farm simulation method for LVRT capability assessment

Distributed energy management in smart grid with dominated electricity provider and multiple microgrids

VSC based DC grid power flow algorithm and AC/DC power flow algorithm

High temperature die attach material on ENEPIG surface for high temperature (250DegC/500hour) and temperature cycle (−65 to +150DegC) applications