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    Planning omni-present networks of the future 

    Type: Conference Paper
    Author : Spruytte, Jonathan; Naudts, Bram; Casier, Koen; Van Ooteghem, Jan; Verbrugge, Sofie
    Publisher: IEEE
    Year: 2014

    Quantitative analysis of feature pixels in the region of interest of ultrasound images for detection of thermal lesion induced by focused ultrasound 

    Type: Conference Paper
    Author : He, Chu-chu; Wang, Shou-bei; Bai, Jing-feng; Ji, Xiang; Chen, Ya-zhu
    Publisher: IEEE
    Year: 2014

    The high temperature resistivityof lithium niobate and related crystals 

    Type: Conference Paper
    Author : Li, Ya-qiao; Zheng, Yan-qing; Tu, Xiao-niu; Xiong, Kai-nan; Lin, Quan-ming; Shi, Er-Wei
    Publisher: IEEE
    Year: 2014

    K-Extended Constrain Independent Relay Node Placement with Base Stations in Two-Tiered Wireless Sensor Network 

    Type: Conference Paper
    Author : Gao, Zhipeng; Chen, Kan; Cheng, Weijing; Hao, Yuwen; Li, Xiaoxue
    Publisher: IEEE
    Year: 2014

    Security Analysis for UHF RFID Tags 

    Type: Conference Paper
    Author : Liu, Xinwei; Sun, Yan; Liu, Jie
    Publisher: IEEE
    Year: 2014

    Analyses of the ultrasonic transducer for nanowire rotary driving 

    Type: Conference Paper
    Author : Wang, Xiao-fei; Hu, Jun-hui
    Publisher: IEEE
    Year: 2014

    Energy efficient computing with tunnel FETs 

    Type: Conference Paper
    Author : Ionescu, A.M.
    Publisher: IEEE
    Year: 2014

    [Front cover] 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Novel double-level-T-gate technology 

    Type: Conference Paper
    Author : Fox, A.; Mikulics, M.; Hardtdegen, H.; Trellenkamp, St.; Arango, Y.C.; Grutzmacher, D.; Sofer, Z.; Gregusova, D.; Novak, J.; Kordos, P.; Marso, M.
    Publisher: IEEE
    Year: 2014

    Influence of structure geometry and bulk traps on switching transients of InAlN/GaN HEMT 

    Type: Conference Paper
    Author : Marek, J.; Satka, A.; Donoval, D.; Molnar, M.; Priesol, J.; Chvala, A.; Pribytny, P.
    Publisher: IEEE
    Year: 2014
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