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On the computation of power in VIE scattering and radiation calculations

Type: Conference Paper

Publisher: IEEE

Year: 2014

Extended Layered Depth Image Representation in Multiview Navigation

Type: Journal Paper

Author : Takyar, Uday; Maugey, Thomas; Frossard, Pascal

Publisher: IEEE

Year: 2014

Technical issues and challenges in the fabrication of a 144-Cell 500× Concentrating Photovoltaic receiver

Type: Conference Paper

Author : Micheli, L.; Sarmah, N.; Fernandez, E.F.; Reddy, K.S.; Mallick, T.K.

Publisher: IEEE

Year: 2014

Flip-chip bonding alignment accuracy enhancement using self-aligned interconnection elements to realize low-temperature construction of ultrafine-pitch copper bump interconnections

Type: Conference Paper

Publisher: IEEE

Year: 2014

Segmentation of ventricles in Alzheimer MR images using Tukey's biweight edge indicator and level set method

Type: Conference Paper

Author : Anandh, K R; Sujatha, C M; Ramakrishnan, S

Publisher: IEEE

Year: 2014

Dual trench gates SOI LIGBT with low conduction loss

Type: Conference Paper

Author : Meihua Liu; Jiang, F.X.C.; Xinnan Lin

Publisher: IEEE

Year: 2014

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On the computation of power in VIE scattering and radiation calculations

Extended Layered Depth Image Representation in Multiview Navigation

Technical issues and challenges in the fabrication of a 144-Cell 500× Concentrating Photovoltaic receiver

Flip-chip bonding alignment accuracy enhancement using self-aligned interconnection elements to realize low-temperature construction of ultrafine-pitch copper bump interconnections

Segmentation of ventricles in Alzheimer MR images using Tukey's biweight edge indicator and level set method

Dual trench gates SOI LIGBT with low conduction loss

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On the computation of power in VIE scattering and radiation calculations

Extended Layered Depth Image Representation in Multiview Navigation

Technical issues and challenges in the fabrication of a 144-Cell 500&#x00D7; Concentrating Photovoltaic receiver

Flip-chip bonding alignment accuracy enhancement using self-aligned interconnection elements to realize low-temperature construction of ultrafine-pitch copper bump interconnections

Segmentation of ventricles in Alzheimer MR images using Tukey's biweight edge indicator and level set method

Dual trench gates SOI LIGBT with low conduction loss

Technical issues and challenges in the fabrication of a 144-Cell 500× Concentrating Photovoltaic receiver