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    A fast passive-heating setup to investigate die-attach delamination in packaged devices 

    Type: Conference Paper
    Author : Pelisset, Tiphaine; Bernardoni, Mirko; Nelhiebel, Michael; Antretter, Thomas
    Publisher: IEEE
    Year: 2014

    iHealth: A fuzzy approach for provisioning intelligent health-care system in smart city 

    Type: Conference Paper
    Author : Bhunia, S.S.; Dhar, S.K.; Mukherjee, N.
    Publisher: IEEE
    Year: 2014

    Sub-THz Sensor Array With Embedded Signal Processing in 90 nm CMOS Technology 

    Type: Journal Paper
    Author : Karolyi, Gergely; Gergelyi, Domonkos; Foldesy, Peter
    Publisher: IEEE
    Year: 2014

    Data-driven Modeling of the Ultrasonic Softening Effect for Robust Copper Wire Bonding 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Demos [breaker page] 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Using participatory design in designing phase of collaborative systems 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    A Generalized Nash Equilibrium Approach for Robust Cognitive Radio Networks via Generalized Variational Inequalities 

    Type: Journal Paper
    Author : Jiaheng Wang; Mugen Peng; Shi Jin; Chunming Zhao
    Publisher: IEEE
    Year: 2014

    High-Sensitivity CMOS Super-Regenerative Receiver with Quench-Controlled High-<formula formulatype="inline"> <img src="/images/tex/228.gif" alt="Q"> </formula> Metamaterial Resonator for Millimeter-Wave Imaging at 96 and 135 GHz 

    Type: Journal Paper
    Author : Yang Shang; Hao Yu; Sanming Hu; Yuan Liang; Xiaojun Bi; Arasu, M.A.
    Publisher: IEEE
    Year: 2014

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