Search

Now showing items 1-6 of 6

Wafer IMS (Injection molded solder) — A new fine pitch solder bumping technology on wafers with solder alloy composition flexibility

Type: Conference Paper

Publisher: IEEE

Year: 2014

Low complexity V-BLAST for massive MIMO

Type: Conference Paper

Author : Alnajjar, K.A. , Smith, P.J. , Woodward, G.K.

Publisher: IEEE

Year: 2014

Comparative study of synthetic and natural clay filled PP films under surface discharges

Type: Conference Paper

Author : Dhara, R. , Rab, M.A. , Basappa, P.

Publisher: IEEE

Year: 2014

Reinforcement learning approaches and evaluation criteria for opportunistic spectrum access

Type: Conference Paper

Author : Robert, C. , Moy, C. , Cheng-Xiang Wang

Publisher: IEEE

Year: 2014

Development of an upper limb rehabilitation robot system for bilateral training

Type: Conference Paper

Publisher: IEEE

Year: 2014

Temperature controlled measurement system for precise characterization of electronic circuits and devices

Type: Conference Paper

Author : Aguirre, P. , Rossi-Aicardi, C.

Publisher: IEEE

Year: 2014

Search

Wafer IMS (Injection molded solder) — A new fine pitch solder bumping technology on wafers with solder alloy composition flexibility

Low complexity V-BLAST for massive MIMO

Comparative study of synthetic and natural clay filled PP films under surface discharges

Reinforcement learning approaches and evaluation criteria for opportunistic spectrum access

Development of an upper limb rehabilitation robot system for bilateral training

Temperature controlled measurement system for precise characterization of electronic circuits and devices

Author

Publisher

Year

Keywords

Type

Language (ISO)

Content Type

Publication Title

Search

Filters

Wafer IMS (Injection molded solder) &#x2014; A new fine pitch solder bumping technology on wafers with solder alloy composition flexibility

Low complexity V-BLAST for massive MIMO

Comparative study of synthetic and natural clay filled PP films under surface discharges

Reinforcement learning approaches and evaluation criteria for opportunistic spectrum access

Development of an upper limb rehabilitation robot system for bilateral training

Temperature controlled measurement system for precise characterization of electronic circuits and devices

Wafer IMS (Injection molded solder) — A new fine pitch solder bumping technology on wafers with solder alloy composition flexibility