An automatic questionnaire survey model based on the collective message over the internet
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: 2014DOI: 10.1109/ICSICT.2014.7021666
Keyword(s): SRAM chips,flip-flops,integrated circuit reliability,low-power electronics,oscillators,BTI stresses,DC stress,SRAM,duty-cycle measurement,dynamic register files,inverter chain based ring oscillator,reliability structure,static BTI stress,Abstracts,Degradation,Integrated circuit reliability,Oscillators,Reliability engineering,Temperature measurement
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An automatic questionnaire survey model based on the collective message over the internet
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| contributor author | Jiang-Liang Hou , Yuh-Zong Chu | |
| date accessioned | 2020-03-12T20:01:40Z | |
| date available | 2020-03-12T20:01:40Z | |
| date issued | 2014 | |
| identifier other | 6846901.pdf | |
| identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/999062 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | An automatic questionnaire survey model based on the collective message over the internet | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8119345 | |
| subject keywords | SRAM chips | |
| subject keywords | flip-flops | |
| subject keywords | integrated circuit reliability | |
| subject keywords | low-power electronics | |
| subject keywords | oscillators | |
| subject keywords | BTI stresses | |
| subject keywords | DC stress | |
| subject keywords | SRAM | |
| subject keywords | duty-cycle measurement | |
| subject keywords | dynamic register files | |
| subject keywords | inverter chain based ring oscillator | |
| subject keywords | reliability structure | |
| subject keywords | static BTI stress | |
| subject keywords | Abstracts | |
| subject keywords | Degradation | |
| subject keywords | Integrated circuit reliability | |
| subject keywords | Oscillators | |
| subject keywords | Reliability engineering | |
| subject keywords | Temperature measurement | |
| identifier doi | 10.1109/ICSICT.2014.7021666 | |
| journal title | omputer Supported Cooperative Work in Design (CSCWD), Proceedings of the 2014 IEEE 18th Internationa | |
| filesize | 1621551 | |
| citations | 0 |