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Simultaneous Testing of Wirebond and Solder Fatigue in IGBT Modules

contributor authorRiedel, G.J. , Valov, M.
date accessioned2020-03-12T19:35:08Z
date available2020-03-12T19:35:08Z
date issued2014
identifier other6776810.pdf
identifier urihttp://libsearch.um.ac.ir:80/fum/handle/fum/982681?locale-attribute=en&show=full
formatgeneral
languageEnglish
publisherIEEE
titleSimultaneous Testing of Wirebond and Solder Fatigue in IGBT Modules
typeConference Paper
contenttypeMetadata Only
identifier padid8097688
subject keywordscalibration
subject keywordsestimation theory
subject keywordsinterferometry
subject keywordsKAT-7 data
subject keywordscalibration artefacts
subject keywordseast-west array
subject keywordsenvironmental errors
subject keywordsgeneral irregular array layout
subject keywordsghost pattern
subject keywordsinstrumental errors
subject keywordsinterferometric data
subject keywordsradio interferometry calibration
subject keywordsAntennas
subject keywordsArrays
subject keywordsCalibration
subject keywordsExtrapolation
subject keywordsLayout
subject keywordsRadio interferometry
subject keywordsVectors
identifier doi10.1109/URSIGASS.2014.6930039
journal titlentegrated Power Systems (CIPS), 2014 8th International Conference on
filesize918692
citations0


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