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International workshop on open and original problems in software language engineering

contributor authorBagge, A.H. , Zaytsev, V.
date accessioned2020-03-12T19:31:20Z
date available2020-03-12T19:31:20Z
date issued2014
identifier other6747223.pdf
identifier urihttp://libsearch.um.ac.ir:80/fum/handle/fum/980519?locale-attribute=en&show=full
formatgeneral
languageEnglish
publisherIEEE
titleInternational workshop on open and original problems in software language engineering
typeConference Paper
contenttypeMetadata Only
identifier padid8094849
subject keywordsII-VI semiconductors
subject keywordsacoustic measurement
subject keywordsdiaphragms
subject keywordsdielectric thin films
subject keywordsdisplacement measurement
subject keywordsmechanical strength
subject keywordsmicrosensors
subject keywordspressure sensors
subject keywordssemiconductor thin films
subject keywordswide band gap semiconductors
subject keywordszinc compounds
subject keywordsIntellisuite
subject keywordsMEMS acoustic sensors
subject keywordsSiO<
subject keywordssub>
subject keywords2<
subject keywords/sub>
subject keywordsZnO
subject keywordsacoustic displacement sensor chips
subject keywordsdiaphragm thickness
subject keywordsdielectric layer
subject keywordsmechanical strength
subject keywordssingle crystalline silicon
subject keywordssound pressure level
subject keywordsstress distributions
subject keywordszinc oxide thin film
subject keywordsAcoustic
identifier doi10.1109/ICGCCEE.2014.6922340
journal titleoftware Maintenance, Reengineering and Reverse Engineering (CSMR-WCRE), 2014 Software Evolution Week
filesize123508
citations0


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