Advances in the Fabrication Processes and Applications of Wafer Level Packaging
Year
: 2014DOI: 10.1115/1.4027397
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Advances in the Fabrication Processes and Applications of Wafer Level Packaging
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| contributor author | Peisheng Liu | |
| contributor author | Jinlan Wang | |
| contributor author | Liangyu Tong | |
| contributor author | Yujuan Tao | |
| date accessioned | 2020-03-12T16:20:53Z | |
| date available | 2020-03-12T16:20:53Z | |
| date issued | 2014 | |
| identifier other | Vhv6ebQ7uLEiKf_8RT5jJyUzHxuWYltmqszCPCEmwrLXXhCESb.pdf | |
| identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/925183?locale-attribute=en | |
| format | general | |
| language | English | |
| title | Advances in the Fabrication Processes and Applications of Wafer Level Packaging | |
| type | Journal Paper | |
| contenttype | Fulltext | |
| contenttype | Fulltext | |
| identifier padid | 7609253 | |
| identifier doi | 10.1115/1.4027397 | |
| journal title | Journal of Electronic Packaging | |
| coverage | Academic | |
| journal volume | 136 | |
| journal issue | 2 | |
| filesize | 1789943 | |
| citations | 1 |