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Near-Field and Far-Field Analyses of Alternating Impedance Electromagnetic Bandgap (AI-EBG) Structure for Mixed-Signal Applications

contributor authorJinwoo Choi
contributor authorDong Gun Kam
contributor authorDaehyun Chung
contributor authorKrishna Srinivasan
contributor authorVinu Govind
contributor authorJoungho Kim
contributor authorMadhavan Swaminathan
date accessioned2020-03-14T16:37:02Z
date available2020-03-14T16:37:02Z
date issued2007
identifier otherIiTXoyZn8NumxqgvR523grp7ER5tK_Hrywci_upzmfIcGe4tuL.pdf
identifier urihttp://libsearch.um.ac.ir:80/fum/handle/fum/1698125?locale-attribute=en&show=full
formatgeneral
languageEnglish
titleNear-Field and Far-Field Analyses of Alternating Impedance Electromagnetic Bandgap (AI-EBG) Structure for Mixed-Signal Applications
typeJournal Paper
contenttypeFulltext
contenttypeFulltext
identifier padid12137225
identifier doi10.1109/TADVP.2007.896921
journal titleIEEE Transactions on Advanced Packaging
coverageAcademic
pages180-190
journal volume30
journal issue2
filesize1841643
citations4


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