Characterization of Bi–Ag–X Solder for High Temperature SiC Die Attach
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سال
: 2014شناسه الکترونیک: 10.1109/TCPMT.2014.2345500
کلیدواژه(گان): ageing,bismuth alloys,melting point,microassembling,nickel alloys,power semiconductor devices,shear strength,silicon compounds,silver alloys,solders,thermal management (packaging),wide band gap semiconductors,Bi-Ag-X solder paste,CuMo surfaces,DBC,NiBi<,sub>,3<,/sub>,SiC,SiC power devices,aging,die shear strength,direct bond copper,high temperature SiC die attach,high-temperature storage,hybrid electric vehicle,intermetallic formation,lead-free solders,melting
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آمار بازدید
Characterization of Bi&#x2013;Ag&#x2013;X Solder for High Temperature SiC Die Attach
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| contributor author | Zhenzhen Shen | |
| contributor author | Kun Fang | |
| contributor author | Johnson, R. Wayne | |
| contributor author | Hamilton, Michael C. | |
| date accessioned | 2020-03-13T00:21:02Z | |
| date available | 2020-03-13T00:21:02Z | |
| date issued | 2014 | |
| identifier issn | 2156-3950 | |
| identifier other | 6891308.pdf | |
| identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1143450 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Characterization of Bi–Ag–X Solder for High Temperature SiC Die Attach | |
| type | Journal Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8326069 | |
| subject keywords | ageing | |
| subject keywords | bismuth alloys | |
| subject keywords | melting point | |
| subject keywords | microassembling | |
| subject keywords | nickel alloys | |
| subject keywords | power semiconductor devices | |
| subject keywords | shear strength | |
| subject keywords | silicon compounds | |
| subject keywords | silver alloys | |
| subject keywords | solders | |
| subject keywords | thermal management (packaging) | |
| subject keywords | wide band gap semiconductors | |
| subject keywords | Bi-Ag-X solder paste | |
| subject keywords | CuMo surfaces | |
| subject keywords | DBC | |
| subject keywords | NiBi< | |
| subject keywords | sub> | |
| subject keywords | 3< | |
| subject keywords | /sub> | |
| subject keywords | SiC | |
| subject keywords | SiC power devices | |
| subject keywords | aging | |
| subject keywords | die shear strength | |
| subject keywords | direct bond copper | |
| subject keywords | high temperature SiC die attach | |
| subject keywords | high-temperature storage | |
| subject keywords | hybrid electric vehicle | |
| subject keywords | intermetallic formation | |
| subject keywords | lead-free solders | |
| subject keywords | melting | |
| identifier doi | 10.1109/TCPMT.2014.2345500 | |
| journal title | Components, Packaging and Manufacturing Technology, IEEE Transactions on | |
| journal volume | 4 | |
| journal issue | 11 | |
| filesize | 5414559 | |
| citations | 0 |