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Great lessons from the back of the envelope

Author:
Bevilacqua, Andrea
Publisher:
IEEE
Year
: 2014
DOI: 10.1109/MSSC.2014.2327711
URI: http://libsearch.um.ac.ir:80/fum/handle/fum/1142889
Keyword(s): Educational institutions,Engineering profession,Laboratories,MIMICs,Microelectronics
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    Great lessons from the back of the envelope

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contributor authorBevilacqua, Andrea
date accessioned2020-03-13T00:20:05Z
date available2020-03-13T00:20:05Z
date issued2014
identifier issn1943-0582
identifier other6882875.pdf
identifier urihttp://libsearch.um.ac.ir:80/fum/handle/fum/1142889
formatgeneral
languageEnglish
publisherIEEE
titleGreat lessons from the back of the envelope
typeJournal Paper
contenttypeMetadata Only
identifier padid8325461
subject keywordsEducational institutions
subject keywordsEngineering profession
subject keywordsLaboratories
subject keywordsMIMICs
subject keywordsMicroelectronics
identifier doi10.1109/MSSC.2014.2327711
journal titleSolid-State Circuits Magazine, IEEE
journal volume6
journal issue3
filesize589533
citations0
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