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Scan-Based Testing of Post-Bond Silicon Interposer Interconnects in 2.5-D ICs

contributor authorRan Wang
contributor authorChakrabarty, Krishnendu
contributor authorEklow, Bill
date accessioned2020-03-13T00:18:58Z
date available2020-03-13T00:18:58Z
date issued2014
identifier issn0278-0070
identifier other6879596.pdf
identifier urihttp://libsearch.um.ac.ir:80/fum/handle/fum/1142203?locale-attribute=en&show=full
formatgeneral
languageEnglish
publisherIEEE
titleScan-Based Testing of Post-Bond Silicon Interposer Interconnects in 2.5-D ICs
typeJournal Paper
contenttypeMetadata Only
identifier padid8324705
subject keywordsboundary scan testing
subject keywordscircuit simulation
subject keywordselemental semiconductors
subject keywordsfault diagnosis
subject keywordsintegrated circuit interconnections
subject keywordsintegrated circuit modelling
subject keywordsintegrated circuit testing
subject keywordssilicon
subject keywords2.5-D ICs
subject keywords2.5-D integration
subject keywordsHSPICE simulation
subject keywordsIEEE 1149.1 standard
subject keywordsModelSim simulation
subject keywordsSi
subject keywordsfault detection
subject keywordsmicrobumps
subject keywordspost-bond silicon interposer interconnects
subject keywordsscan-based testing
subject keywordstest-access port controller
subject keywordsClocks
subject keywordsComputer architecture
subject keywordsDelays
subject keywordsIntegrated circuit interconnections
subject keywordsSilicon
subject keywordsStandar
identifier doi10.1109/TCAD.2014.2331336
journal titleComputer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
journal volume33
journal issue9
filesize3461345
citations0


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